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Recent progress in strain-engineered elastic platforms for stretchable thin-film devices.
Cho, Hyeon; Lee, Byeongmoon; Jang, Dongju; Yoon, Jinsu; Chung, Seungjun; Hong, Yongtaek.
  • Cho H; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, Korea. yongtaek@snu.ac.kr.
  • Lee B; Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul 02792, Korea. seungjun@kist.re.kr.
  • Jang D; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, Korea. yongtaek@snu.ac.kr.
  • Yoon J; Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul 08826, Korea. yongtaek@snu.ac.kr.
  • Chung S; Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul 02792, Korea. seungjun@kist.re.kr.
  • Hong Y; KHU-KIST Department of Converging Science and Technology, Kyung Hee University, Seoul, 02447, Korea.
Mater Horiz ; 9(8): 2053-2075, 2022 08 01.
Article en En | MEDLINE | ID: mdl-35703019
ABSTRACT
Strain-engineered elastic platforms that can efficiently distribute mechanical stress under deformation offer adjustable mechanical compliance for stretchable electronic systems. By fully exploiting strain-free regions that are favourable for fabricating thin-film devices and interconnecting with reliably stretchable conductors, various electronic systems can be integrated onto stretchable platforms with the assistance of strain engineering strategies. Over the last decade, applications of multifunctional stretchable thin-film devices simultaneously exhibiting superior electrical and mechanical performance have been demonstrated, shedding light on the realization of further reliable human-machine interfaces. This review highlights recent developments in enabling technologies for strain-engineered elastic platforms. In particular, representative approaches to realize strain-engineered substrates and stretchable interconnects in island-bridge configurations are introduced from the perspective of the material homogeneity and structural design of the substrate. State-of-the-art achievements in sophisticated stretchable electronic devices on strain-engineered elastic platforms are also presented, such as stretchable sensors, energy devices, thin-film transistors, and displays, and then, the challenges and outlook are discussed.
Asunto(s)

Texto completo: 1 Banco de datos: MEDLINE Asunto principal: Dispositivos Electrónicos Vestibles Límite: Humans Idioma: En Año: 2022 Tipo del documento: Article

Texto completo: 1 Banco de datos: MEDLINE Asunto principal: Dispositivos Electrónicos Vestibles Límite: Humans Idioma: En Año: 2022 Tipo del documento: Article