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Fabrication of Homogeneous Nanoporous Structure on 4H-/6H-SiC Wafer Surface via Efficient and Eco-Friendly Electrolytic Plasma-Assisted Chemical Etching.
Zhan, Shunda; Liu, Bowen; Yu, Xuemeng; Chen, Xihan; Zeng, Guosong; Zhao, Yonghua.
  • Zhan S; School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, China.
  • Liu B; Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Yu X; Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Chen X; Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Zeng G; Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
  • Zhao Y; Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
Small ; 19(14): e2205720, 2023 Apr.
Article en En | MEDLINE | ID: mdl-36634983
ABSTRACT
Nanoporous single-crystal silicon carbide (SiC) is widely used in various applications such as protein dialysis, as a catalyst support, and in photoanodes for photoelectrochemical water splitting. However, the fabrication of nano-structured SiC is challenging owing to its extreme chemical and mechanical stability. This study demonstrates a highly-efficient, open-circuit electrolytic plasma-assisted chemical etching (EPACE) method without aggressive fluorine-containing reactants. The EPACE method enables the nano-structuring of SiC via a plasma-enveloped microtool traversing over the target material in an electrolyte bath. Through process design, EPACE readily produces a uniform nanoporous layer on a 4H-SiC wafer in KOH aqueous solution, with adjustable pore diameters in the range 40-130 nm. Plasma diagnosis by optical emission spectrometry (OES) and surface microanalysis reveal that EPACE realizes a nanoporous structure by electrolytic plasma-assisted oxidation and subsequent thermochemical reduction of an oxide. An increase in voltage or a decrease in etch gap intensifies the plasma and improves the etching efficiency. The maximum etch rate and depth reach 540 nm min-1 and 10 µm, respectively, demonstrating the significant potential of the approach as a time-saving and sustainable nanofabrication method for industrial applications. Further, the effectiveness of the fabricated SiC nanoporous structure for application in photoelectrochemical water splitting is demonstrated.
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Texto completo: 1 Banco de datos: MEDLINE Idioma: En Año: 2023 Tipo del documento: Article

Texto completo: 1 Banco de datos: MEDLINE Idioma: En Año: 2023 Tipo del documento: Article