Smooth, Chemically Altered Nucleating Platform for Abrupt Performance Enhancement of Ultrathin Cu-Layer-Based Transparent Electrodes.

Vo, Tran Thi Bao; Lim, Jaeun; Joo, Si Hyeon; Kim, Heechang; Lee, Taehyeong; Bae, Jong-Seong; Jeong, Eunwook; Kwon, Min-Suk; Yun, Jungheum; Choi, Dooho

Vo, Tran Thi Bao; Lim, Jaeun; Joo, Si Hyeon; Kim, Heechang; Lee, Taehyeong; Bae, Jong-Seong; Jeong, Eunwook; Kwon, Min-Suk; Yun, Jungheum; Choi, Dooho.

Vo TTB; School of Advanced Materials Engineering, Dong-Eui University, 176 Eomgwangro, Busan 47340, Republic of Korea.
Lim J; School of Advanced Materials Engineering, Dong-Eui University, 176 Eomgwangro, Busan 47340, Republic of Korea.
Joo SH; School of Advanced Materials Engineering, Dong-Eui University, 176 Eomgwangro, Busan 47340, Republic of Korea.
Kim H; School of Advanced Materials Engineering, Dong-Eui University, 176 Eomgwangro, Busan 47340, Republic of Korea.
Lee T; School of Advanced Materials Engineering, Dong-Eui University, 176 Eomgwangro, Busan 47340, Republic of Korea.
Bae JS; Korea Basic Science Institute (Busan Center), 1 Gwahaksandanro, Busan 46742, Republic of Korea.
Jeong E; Extreme Materials Institute, Korea Institute of Materials Science, Changwon, Gyeongnam 51508, Republic of Korea.
Kwon MS; Department of Electrical Engineering, Ulsan National Institute of Science and Technology, Ulsan 44919, Republic of Korea.
Yun J; Extreme Materials Institute, Korea Institute of Materials Science, Changwon, Gyeongnam 51508, Republic of Korea.
Choi D; School of Advanced Materials Engineering, Dong-Eui University, 176 Eomgwangro, Busan 47340, Republic of Korea.