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Fabrication of nanowire electronics on nonconventional substrates by water-assisted transfer printing method.
Lee, Chi Hwan; Kim, Dong Rip; Zheng, Xiaolin.
Afiliação
  • Lee CH; Department of Mechanical Engineering, Stanford University, Stanford, California 94305, United States.
Nano Lett ; 11(8): 3435-9, 2011 Aug 10.
Article em En | MEDLINE | ID: mdl-21696196
ABSTRACT
We report a simple, versatile, and wafer-scale water-assisted transfer printing method (WTP) that enables the transfer of nanowire devices onto diverse nonconventional substrates that were not easily accessible before, such as paper, plastics, tapes, glass, polydimethylsiloxane (PDMS), aluminum foil, and ultrathin polymer substrates. The WTP method relies on the phenomenon of water penetrating into the interface between Ni and SiO(2). The transfer yield is nearly 100%, and the transferred devices, including NW resistors, diodes, and field effect transistors, maintain their original geometries and electronic properties with high fidelity.

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2011 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2011 Tipo de documento: Article