Different methods to alter surface morphology of high aspect ratio structures.

Leber, M; Shandhi, M M H; Hogan, A; Solzbacher, F; Bhandari, R; Negi, S

Leber, M; Shandhi, M M H; Hogan, A; Solzbacher, F; Bhandari, R; Negi, S.

Afiliação

Leber M; Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, UT, USA.
Shandhi MM; Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, UT, USA.
Hogan A; Blackrock Microsystems, Salt Lake City, UT, USA.
Solzbacher F; Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, UT, USA.
Bhandari R; Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, UT, USA; Blackrock Microsystems, Salt Lake City, UT, USA.
Negi S; Department of Electrical and Computer Engineering, University of Utah, Salt Lake City, UT, USA; Blackrock Microsystems, Salt Lake City, UT, USA.

Appl Surf Sci ; 365: 180-190, 2016 Mar 01.

Article em En | MEDLINE | ID: mdl-26806992

Palavras-chave

Deep Reactive Ion Etching (DRIE); Dry Etching; Focused Ion Beam; Interface Impedance; Laser Ablation; Reactive Ion Etching (RIE); Rough Surfaces; Surface Modification

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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2016 Tipo de documento: Article

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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2016 Tipo de documento: Article