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Sputtered Inx(O,S)y Buffer Layers for Cu(In,Ga)Se2 Thin-Film Solar Cells: Engineering of Band Alignment and Interface Properties.
Ho, Wei-Hao; Hsu, Chia-Hao; Wei, Shih-Yuan; Cai, Chung-Hao; Huang, Wei-Chih; Lai, Chih-Huang.
Afiliação
  • Ho WH; Department of Materials Science and Engineering, National Tsing Hua University , Hsinchu 30013, Taiwan, Republic of China.
  • Hsu CH; Department of Materials Science and Engineering, National Tsing Hua University , Hsinchu 30013, Taiwan, Republic of China.
  • Wei SY; Department of Materials Science and Engineering, National Tsing Hua University , Hsinchu 30013, Taiwan, Republic of China.
  • Cai CH; Department of Materials Science and Engineering, National Tsing Hua University , Hsinchu 30013, Taiwan, Republic of China.
  • Huang WC; Department of Materials Science and Engineering, National Tsing Hua University , Hsinchu 30013, Taiwan, Republic of China.
  • Lai CH; Department of Materials Science and Engineering, National Tsing Hua University , Hsinchu 30013, Taiwan, Republic of China.
ACS Appl Mater Interfaces ; 9(20): 17586-17594, 2017 May 24.
Article em En | MEDLINE | ID: mdl-28470058
ABSTRACT
We propose a simple approach to engineering the sputtered Inx(O,S)y/Cu(In,Ga)Se2 heterojunction, in terms of band alignment and interface properties. The band alignment was tailored by tuning the base pressure of the sputtering deposition to incorporate oxygen into deposited In2S3 layers (termed as Inx(O,S)y). The interface properties were improved by optimizing the air-annealing temperature on Inx(O,S)y/Cu(In,Ga)Se2 stacked layers. Increasing the base pressure raises the O/(S + O) ratio contained in deposited Inx(O,S)y films and thus widens the band gaps. This could effectively tailor the conduction band offset (ΔEC) at the Inx(O,S)y/Cu(In,Ga)Se2 interface from a cliff (-0.25 eV) to a nearly flat band (0.07 eV) alignment. On the other hand, the extra air annealing at 235 °C did not significantly change the band alignment but did ameliorate the interface properties by reducing the Cu content at the Cu(In,Ga)Se2 surface and diminish the interface defect density induced by sputtering damages. The former might enhance the type of inversion and increase the hole barrier at the interface, preventing the detrimental recombination behavior. The latter could effectively strengthen the junction quality. Consequently, our approach substantially enhances the cell efficiency from 2.30% to 11.04%.
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2017 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2017 Tipo de documento: Article