An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant.

Song, Min-Jae; Kim, Kwon-Hee; Yoon, Gil-Sang; Park, Hyung-Pil; Kim, Heung-Kyu.

Afiliação

Song MJ; Molds & Dies Technology R&DB Group, Korea Institute of Industrial Technology, 7-47, Songdo-dong, Yeonsu-gu, Inchoen 406-840, Korea. mjsong@kitech.re.kr.
Kim KH; Department of Mechanical Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-713, Korea. mjsong@kitech.re.kr.
Yoon GS; Department of Mechanical Engineering, Korea University, Anam-dong, Seongbuk-gu, Seoul 136-713, Korea. kwonhkim@korea.ac.kr.
Park HP; Molds & Dies Technology R&DB Group, Korea Institute of Industrial Technology, 7-47, Songdo-dong, Yeonsu-gu, Inchoen 406-840, Korea. seviaygs@kitech.re.kr.
Kim HK; Molds & Dies Technology R&DB Group, Korea Institute of Industrial Technology, 7-47, Songdo-dong, Yeonsu-gu, Inchoen 406-840, Korea. php76@kitech.re.kr.

Materials (Basel) ; 7(6): 4088-4104, 2014 May 27.

Article em En | MEDLINE | ID: mdl-28788666