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t-Si64 : A Novel Silicon Allotrope.
Fan, Qingyang; Niu, Rui; Zhang, Wenzhu; Zhang, Wei; Ding, Yingchun; Yun, Sining.
Afiliação
  • Fan Q; School of Information and Control Engineering, Xi'an University of Architecture and Technology, Xi'an, 710055, People's Republic of China.
  • Niu R; Xidian University, Xi'an, Xi'an, 710071, People's Republic of China.
  • Zhang W; School of Information and Control Engineering, Xi'an University of Architecture and Technology, Xi'an, 710055, People's Republic of China.
  • Zhang W; School of Microelectronics, Xidian University, Xi'an Xi'an, 710071, People's Republic of China.
  • Ding Y; College of Optoelectronics Technology, Chengdu University of Information Technology, Chengdu, 610225, People's Republic of China.
  • Yun S; Functional Materials Laboratory (FML) School of Materials & Mineral Resources, Xi'an University of Architecture and Technology, Xi'an, 710055, People's Republic of China.
Chemphyschem ; 20(1): 128-133, 2019 01 07.
Article em En | MEDLINE | ID: mdl-30397996
ABSTRACT
Utilizing first principle calculations, a novel Si64 silicon allotrope in the I41 /amd space group with tetragonal symmetry (denoted as t-Si64 below) is proposed in this work. In addition, also its structural, anisotropic mechanical, and electronic properties along with its minimum thermal conductivity κmin were predicted. The mechanical and thermodynamic stability of t-Si64 were evaluated by means of elastic constants and phonon spectra. The electronic band structure indicates that t-Si64 is an indirect band gap semiconductor with a band gap 0.67 eV (primitive cell) compared to a direct band gap of 0.70 eV with respect to a conventional cell. The minimum thermal conductivity of t-Si64 (0.74 W cm-1 K-1 ) is much smaller than that of diamond silicon (1.13 W cm-1 K-1 ). Therefore, Si-Ge alloys in the I41 /amd space group are potential thermoelectric materials.
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article