Advanced approaches for quantitative characterization of thermal transport properties in soft materials using thin, conformable resistive sensors.

Crawford, Kaitlyn E; Ma, Yinji; Krishnan, Siddharth; Wei, Chen; Capua, Daniel; Xue, Yeguang; Xu, Shuai; Xie, Zhaoqian; Won, Sang Min; Tian, Limei; Webb, Chad; Li, Yajing; Feng, Xue; Huang, Yonggang; Rogers, John A

Crawford, Kaitlyn E; Ma, Yinji; Krishnan, Siddharth; Wei, Chen; Capua, Daniel; Xue, Yeguang; Xu, Shuai; Xie, Zhaoqian; Won, Sang Min; Tian, Limei; Webb, Chad; Li, Yajing; Feng, Xue; Huang, Yonggang; Rogers, John A.

Afiliação

Crawford KE; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Ma Y; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
Krishnan S; Department of Materials Science and Engineering, University of Central Florida, Orlando, FL 32816, USA.
Wei C; AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China.
Capua D; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Xue Y; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
Xu S; Departments of Civil and Environmental Engineering, Mechanical Engineering, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Xie Z; Department of Biomedical Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Won SM; Departments of Civil and Environmental Engineering, Mechanical Engineering, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Tian L; Department of Dermatology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA.
Webb C; Departments of Civil and Environmental Engineering, Mechanical Engineering, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Li Y; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Feng X; Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Huang Y; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
Rogers JA; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.