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Materials Strategies and Device Architectures of Emerging Power Supply Devices for Implantable Bioelectronics.
Huang, Xueying; Wang, Liu; Wang, Huachun; Zhang, Bozhen; Wang, Xibo; Stening, Rowena Y Z; Sheng, Xing; Yin, Lan.
Afiliação
  • Huang X; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
  • Wang L; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
  • Wang H; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology and Beijing Innovation Center for Future Chips, Tsinghua University, Beijing, 100084, P. R. China.
  • Zhang B; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
  • Wang X; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
  • Stening RYZ; Department of Materials Science, Trinity College, University of Oxford, Oxford, OX13BH, UK.
  • Sheng X; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology and Beijing Innovation Center for Future Chips, Tsinghua University, Beijing, 100084, P. R. China.
  • Yin L; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
Small ; 16(15): e1902827, 2020 04.
Article em En | MEDLINE | ID: mdl-31513333
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Texto completo: 1 Base de dados: MEDLINE Assunto principal: Próteses e Implantes / Fontes de Energia Bioelétrica Limite: Humans Idioma: En Ano de publicação: 2020 Tipo de documento: Article
Texto completo
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XML
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Texto completo: 1 Base de dados: MEDLINE Assunto principal: Próteses e Implantes / Fontes de Energia Bioelétrica Limite: Humans Idioma: En Ano de publicação: 2020 Tipo de documento: Article