Your browser doesn't support javascript.
loading
Ecofriendly Catechol Lipid Bioresin for Low-Temperature Processed Electrode Patterns with Strong Durability.
Lee, Bora; Han, Hyemi; Hahn, Hoh-Gyu; Doh, Jeong Mann; Park, Se-Hoon; Lee, Eunji; Lee, Sang-Soo; Park, Cheolmin; Lim, Ho Sun; Lim, Jung Ah.
Afiliação
  • Lee B; Center for Opto-Electronic Materials and Devices, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea.
  • Han H; Department of Materials Science & Engineering, Yonsei University, Seoul 03722, Republic of Korea.
  • Hahn HG; Center for Opto-Electronic Materials and Devices, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea.
  • Doh JM; Center for Heritage Science, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea.
  • Park SH; Materials Architecturing Research Center, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea.
  • Lee E; ICT Device Packaging Research Center, Korea Electronics Technology Institute, Seongnam-si, Gyeonggi-do 13509, Republic of Korea.
  • Lee SS; School of Materials Science and Engineering, Gwangju Institute of Science and Technology, Gwangju 61005, Republic of Korea.
  • Park C; Photo-Electronic Hybrids Research Center, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea.
  • Lim HS; Department of Materials Science & Engineering, Yonsei University, Seoul 03722, Republic of Korea.
  • Lim JA; Department of Chemical and Biological Engineering, Sookmyung Women's University, Seoul 04310, Republic of Korea.
ACS Appl Mater Interfaces ; 12(14): 16864-16876, 2020 Apr 08.
Article em En | MEDLINE | ID: mdl-32151137
ABSTRACT
We demonstrated catechol lipid-based bioresin, which is collected from lacquer trees, to produce conductive pastes that can be processed at low temperatures, which are highly adhesive and multidurable. Our conductive paste, which consists of catechol lipid-based urushiol resin and a multimodal mixture of silver fillers, exhibited stable dispersion with shear thinning properties. The urushiol lacquer induced spontaneous reduction of silver salt at the surface of the silver fillers, thereby contributing to lower the contact resistance between conductive fillers in the electrical conduction. Furthermore, the directional volume shrinkage of the urushiol lacquer matrix in a cross-linking reaction resulted in a highly ordered microstructure of the silver fillers with layer-by-layer stacking of the silver flakes. This structure contributed to the improvement of the electrical contact between fillers as well as excellent mechanical hardness, anti-scratch capability, and the long-term environmental stability of the conductive films. Conductive films based on the silver paste with urushiol lacquer exhibited low electrical resistivity below 4.4 × 10-5 Ω cm, 5B-class strong adhesion strength, and high hardness exceeding 200 MPa. Finally, we demonstrated the facile room-temperature processability and screen printability of the UL-Ag paste by fabricating a printed antenna and three-dimensional (3D) electrode assembly based on a plastic 3D block.
Palavras-chave

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2020 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2020 Tipo de documento: Article