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Effect of Thermal Boundary Resistance between the Interconnect Metal and Dielectric Interlayer on Temperature Increase of Interconnects in Deeply Scaled VLSI.
Zhan, Tianzhuo; Oda, Kaito; Ma, Shuaizhe; Tomita, Motohiro; Jin, Zhicheng; Takezawa, Hiroki; Mesaki, Kohei; Wu, Yen-Ju; Xu, Yibin; Matsukawa, Takashi; Matsuki, Takeo; Watanabe, Takanobu.
Afiliação
  • Zhan T; Waseda University, 3-4-1 O̅okubo, Shinjuku-ku, Tokyo 169-8555, Japan.
  • Oda K; Waseda University, 3-4-1 O̅okubo, Shinjuku-ku, Tokyo 169-8555, Japan.
  • Ma S; Waseda University, 3-4-1 O̅okubo, Shinjuku-ku, Tokyo 169-8555, Japan.
  • Tomita M; Waseda University, 3-4-1 O̅okubo, Shinjuku-ku, Tokyo 169-8555, Japan.
  • Jin Z; Waseda University, 3-4-1 O̅okubo, Shinjuku-ku, Tokyo 169-8555, Japan.
  • Takezawa H; Waseda University, 3-4-1 O̅okubo, Shinjuku-ku, Tokyo 169-8555, Japan.
  • Mesaki K; Waseda University, 3-4-1 O̅okubo, Shinjuku-ku, Tokyo 169-8555, Japan.
  • Wu YJ; National Institute for Materials Science, 1-2-1 Sengen, Tsukuba 305-0047, Japan.
  • Xu Y; National Institute for Materials Science, 1-2-1 Sengen, Tsukuba 305-0047, Japan.
  • Matsukawa T; National Institute of Advanced Industrial Science and Technology, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8560, Japan.
  • Matsuki T; Waseda University, 3-4-1 O̅okubo, Shinjuku-ku, Tokyo 169-8555, Japan.
  • Watanabe T; National Institute of Advanced Industrial Science and Technology, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8560, Japan.
ACS Appl Mater Interfaces ; 12(19): 22347-22356, 2020 May 13.
Article em En | MEDLINE | ID: mdl-32315529
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Texto completo: 1 Base de dados: MEDLINE Tipo de estudo: Prognostic_studies Idioma: En Ano de publicação: 2020 Tipo de documento: Article
Texto completo
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XML
PubMed Links
Buscar no Google

Texto completo: 1 Base de dados: MEDLINE Tipo de estudo: Prognostic_studies Idioma: En Ano de publicação: 2020 Tipo de documento: Article