Effect of the Electroless Nickel, Electroless Palladium, and Immersion Gold Multilayer as a Diffusion Barrier on the Bonding Strength of BiTe-Based Thermoelectric Modules.

Nguyen, Yen Ngoc; Dang, Khanh Quoc; Son, Injoon

Nguyen, Yen Ngoc; Dang, Khanh Quoc; Son, Injoon.

Afiliação

Nguyen YN; School of Materials Science and Engineering, Kyungpook National University, Daegu 41566, South Korea.
Dang KQ; School of Materials Science and Engineering, Hanoi University of Science and Technology, Hanoi, 100000, Vietnam.
Son I; School of Materials Science and Engineering, Kyungpook National University, Daegu 41566, South Korea.

J Nanosci Nanotechnol ; 21(8): 4498-4502, 2021 Aug 01.

Article em En | MEDLINE | ID: mdl-33714351

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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article

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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article