Effect of the Electroless Nickel, Electroless Palladium, and Immersion Gold Multilayer as a Diffusion Barrier on the Bonding Strength of BiTe-Based Thermoelectric Modules.
J Nanosci Nanotechnol
; 21(8): 4498-4502, 2021 Aug 01.
Article
em En
| MEDLINE
| ID: mdl-33714351
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2021
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