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High-Temperature Skin Softening Materials Overcoming the Trade-Off between Thermal Conductivity and Thermal Contact Resistance.
Kim, Taehun; Kim, Seongkyun; Kim, Eungchul; Kim, Taesung; Cho, Jungwan; Song, Changsik; Baik, Seunghyun.
Afiliação
  • Kim T; School of Mechanical Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea.
  • Kim S; School of Mechanical Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea.
  • Kim E; School of Mechanical Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea.
  • Kim T; School of Mechanical Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea.
  • Cho J; SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University, Suwon, 16419, Republic of Korea.
  • Song C; School of Mechanical Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea.
  • Baik S; Department of Chemistry, Sungkyunkwan University, Suwon, 16419, Republic of Korea.
Small ; 17(38): e2102128, 2021 09.
Article em En | MEDLINE | ID: mdl-34390187
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Texto completo: 1 Base de dados: MEDLINE Assunto principal: Nanotubos de Carbono / Nanopartículas Metálicas Idioma: En Ano de publicação: 2021 Tipo de documento: Article
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Nanotubos de Carbono / Nanopartículas Metálicas Idioma: En Ano de publicação: 2021 Tipo de documento: Article