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Complex 3D microfluidic architectures formed by mechanically guided compressive buckling.
Luan, Haiwen; Zhang, Qihui; Liu, Tzu-Li; Wang, Xueju; Zhao, Shiwei; Wang, Heling; Yao, Shenglian; Xue, Yeguang; Kwak, Jean Won; Bai, Wubin; Xu, Yameng; Han, Mengdi; Li, Kan; Li, Zhengwei; Ni, Xinchen; Ye, Jilong; Choi, Dongwhi; Yang, Quansan; Kim, Jae-Hwan; Li, Shuo; Chen, Shulin; Wu, Changsheng; Lu, Di; Chang, Jan-Kai; Xie, Zhaoqian; Huang, Yonggang; Rogers, John A.
Afiliação
  • Luan H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Zhang Q; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Liu TL; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Wang X; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Zhao S; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Wang H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Yao S; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Xue Y; Department of Materials Science and Engineering, Ohio State University, Columbus, OH 43210, USA.
  • Kwak JW; Department of Materials Science and Engineering, University of Connecticut, Storrs, CT 06269, USA.
  • Bai W; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Xu Y; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Han M; School of Aeronautic Science and Engineering, Beihang University, Beijing 100191, China.
  • Li K; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Li Z; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Ni X; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Ye J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Choi D; Beijing Advanced Innovation Center for Materials Genome Engineering, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
  • Yang Q; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Kim JH; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Li S; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Chen S; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Wu C; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Lu D; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Chang JK; Department of Applied Physical Sciences, University of North Carolina, Chapel Hill, NC 27514, USA.
  • Xie Z; Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Huang Y; Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA.
  • Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
Sci Adv ; 7(43): eabj3686, 2021 Oct 22.
Article em En | MEDLINE | ID: mdl-34669471
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article
Texto completo
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XML
PubMed Links
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article