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Author Correction: Battery-free, wireless soft sensors for continuous multi-site measurements of pressure and temperature from patients at risk for pressure injuries.
Oh, Yong Suk; Kim, Jae-Hwan; Xie, Zhaoqian; Cho, Seokjoo; Han, Hyeonseok; Jeon, Sung Woo; Park, Minsu; Namkoong, Myeong; Avila, Raudel; Song, Zhen; Lee, Sung-Uk; Ko, Kabseok; Lee, Jungyup; Lee, Je-Sang; Min, Weon Gi; Lee, Byeong-Ju; Choi, Myungwoo; Chung, Ha Uk; Kim, Jongwon; Han, Mengdi; Koo, Jahyun; Choi, Yeon Sik; Kwak, Sung Soo; Kim, Sung Bong; Kim, Jeonghyun; Choi, Jungil; Kang, Chang-Mo; Kim, Jong Uk; Kwon, Kyeongha; Won, Sang Min; Baek, Janice Mihyun; Lee, Yujin; Kim, So Young; Lu, Wei; Vazquez-Guardado, Abraham; Jeong, Hyoyoung; Ryu, Hanjun; Lee, Geumbee; Kim, Kyuyoung; Kim, Seunghwan; Kim, Min Seong; Choi, Jungrak; Choi, Dong Yun; Yang, Quansan; Zhao, Hangbo; Bai, Wubin; Jang, Hokyung; Yu, Yongjoon; Lim, Jaeman; Guo, Xu.
Afiliação
  • Oh YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
  • Kim JH; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
  • Xie Z; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Cho S; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
  • Han H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Jeon SW; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.
  • Park M; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.
  • Namkoong M; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
  • Avila R; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
  • Song Z; Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Lee SU; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Ko K; Department of Biomedical Engineering, Texas A&M University, College Station, TX, USA.
  • Lee J; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Lee JS; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.
  • Min WG; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.
  • Lee BJ; Advanced 3D Printing Technology Development Division, Korea Atomic Energy Research Institute, Daejeon, Republic of Korea.
  • Choi M; Qualcomm Institute, La Jolla, CA, USA.
  • Chung HU; Sibel Health Inc, Niles, IL, USA.
  • Kim J; Department of Rehabilitation Medicine, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.
  • Han M; Department of Planning and Development, Gimhae Hansol Rehabilitation & Convalescent Hospital, Gimhae, Republic of Korea.
  • Koo J; Department of Rehabilitation Medicine, Pusan national university hospital, Busan, Republic of Korea.
  • Choi YS; Department of Materials Science and Engineering, KAIST Institute for The Nanocentury (KINC), Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
  • Kwak SS; Sibel Health Inc, Niles, IL, USA.
  • Kim SB; Sibel Health Inc, Niles, IL, USA.
  • Kim J; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Choi J; Department of Mechanical Engineering, Kyung Hee University, Yongin, Republic of Korea.
  • Kang CM; Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, People's Republic of China.
  • Kim JU; School of Biomedical Engineering, Korea University, Seoul, Republic of Korea.
  • Kwon K; Interdisciplinary Program in Precision Public Health, Korea University, Seoul, Republic of Korea.
  • Won SM; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
  • Baek JM; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Lee Y; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Kim SY; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Lu W; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
  • Vazquez-Guardado A; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Jeong H; Department of Electronic Convergence Engineering, Kwangwoon University, Seoul, Republic of Korea.
  • Ryu H; School of Mechanical Engineering, Kookmin University, Seoul, Republic of Korea.
  • Lee G; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA.
  • Kim K; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Kim S; School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea.
  • Kim MS; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
  • Choi J; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.
  • Choi DY; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
  • Yang Q; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
  • Zhao H; Department of Materials Science and Engineering, University of Illinois at Urbana Champaign, Urbana, IL, USA.
  • Bai W; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
  • Jang H; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
  • Yu Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Lim J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Guo X; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
Nat Commun ; 12(1): 6827, 2021 Nov 18.
Article em En | MEDLINE | ID: mdl-34795252
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Texto completo: 1 Base de dados: MEDLINE Tipo de estudo: Etiology_studies / Risk_factors_studies Idioma: En Ano de publicação: 2021 Tipo de documento: Article
Texto completo
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XML
PubMed Links
Buscar no Google

Texto completo: 1 Base de dados: MEDLINE Tipo de estudo: Etiology_studies / Risk_factors_studies Idioma: En Ano de publicação: 2021 Tipo de documento: Article