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Hexagonal boron nitride as a low-loss dielectric for superconducting quantum circuits and qubits.
Wang, Joel I-J; Yamoah, Megan A; Li, Qing; Karamlou, Amir H; Dinh, Thao; Kannan, Bharath; Braumüller, Jochen; Kim, David; Melville, Alexander J; Muschinske, Sarah E; Niedzielski, Bethany M; Serniak, Kyle; Sung, Youngkyu; Winik, Roni; Yoder, Jonilyn L; Schwartz, Mollie E; Watanabe, Kenji; Taniguchi, Takashi; Orlando, Terry P; Gustavsson, Simon; Jarillo-Herrero, Pablo; Oliver, William D.
Afiliação
  • Wang JI; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA. joelwang@mit.edu.
  • Yamoah MA; Department of Physics, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Li Q; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Karamlou AH; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Dinh T; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Kannan B; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Braumüller J; Department of Physics, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Kim D; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Melville AJ; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Muschinske SE; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Niedzielski BM; MIT Lincoln Laboratory, Lexington, MA, USA.
  • Serniak K; MIT Lincoln Laboratory, Lexington, MA, USA.
  • Sung Y; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Winik R; MIT Lincoln Laboratory, Lexington, MA, USA.
  • Yoder JL; MIT Lincoln Laboratory, Lexington, MA, USA.
  • Schwartz ME; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Watanabe K; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Taniguchi T; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
  • Orlando TP; MIT Lincoln Laboratory, Lexington, MA, USA.
  • Gustavsson S; MIT Lincoln Laboratory, Lexington, MA, USA.
  • Jarillo-Herrero P; Research Center for Functional Materials, National Institute for Materials Science, Tsukuba, Japan.
  • Oliver WD; International Center for Materials Nanoarchitectonics, National Institute for Materials Science, Tsukuba, Japan.
Nat Mater ; 21(4): 398-403, 2022 Apr.
Article em En | MEDLINE | ID: mdl-35087240
ABSTRACT
Dielectrics with low loss at microwave frequencies are imperative for high-coherence solid-state quantum computing platforms. Here we study the dielectric loss of hexagonal boron nitride (hBN) thin films in the microwave regime by measuring the quality factor of parallel-plate capacitors (PPCs) made of NbSe2-hBN-NbSe2 heterostructures integrated into superconducting circuits. The extracted microwave loss tangent of hBN is bounded to be at most in the mid-10-6 range in the low-temperature, single-photon regime. We integrate hBN PPCs with aluminium Josephson junctions to realize transmon qubits with coherence times reaching 25 µs, consistent with the hBN loss tangent inferred from resonator measurements. The hBN PPC reduces the qubit feature size by approximately two orders of magnitude compared with conventional all-aluminium coplanar transmons. Our results establish hBN as a promising dielectric for building high-coherence quantum circuits with substantially reduced footprint and with a high energy participation that helps to reduce unwanted qubit cross-talk.

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article