Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits.

Zhan, Tianzhuo; Sahara, Keita; Takeuchi, Haruki; Yokogawa, Ryo; Oda, Kaito; Jin, Zhicheng; Deng, Shikang; Tomita, Motohiro; Wu, Yen-Ju; Xu, Yibin; Matsuki, Takeo; Wang, Haidong; Song, Mengjie; Guan, Sujun; Ogura, Atsushi; Watanabe, Takanobu

Zhan, Tianzhuo; Sahara, Keita; Takeuchi, Haruki; Yokogawa, Ryo; Oda, Kaito; Jin, Zhicheng; Deng, Shikang; Tomita, Motohiro; Wu, Yen-Ju; Xu, Yibin; Matsuki, Takeo; Wang, Haidong; Song, Mengjie; Guan, Sujun; Ogura, Atsushi; Watanabe, Takanobu.

Afiliação

Zhan T; Toyo University, 2100 Kujirai, Kawagoe, Saitama 350-8585, Japan.
Sahara K; Waseda University, 3-4-1 Ookubo, Shinjuku-ku, Tokyo 169-8555, Japan.
Takeuchi H; Meiji University, 1-1-1 Higashi-Mita, Tama-ku, Kawasaki, Kanagawa 214-8571, Japan.
Yokogawa R; Meiji University, 1-1-1 Higashi-Mita, Tama-ku, Kawasaki, Kanagawa 214-8571, Japan.
Oda K; Meiji University, 1-1-1 Higashi-Mita, Tama-ku, Kawasaki, Kanagawa 214-8571, Japan.
Jin Z; Waseda University, 3-4-1 Ookubo, Shinjuku-ku, Tokyo 169-8555, Japan.
Deng S; Waseda University, 3-4-1 Ookubo, Shinjuku-ku, Tokyo 169-8555, Japan.
Tomita M; Waseda University, 3-4-1 Ookubo, Shinjuku-ku, Tokyo 169-8555, Japan.
Wu YJ; Waseda University, 3-4-1 Ookubo, Shinjuku-ku, Tokyo 169-8555, Japan.
Xu Y; National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan.
Matsuki T; National Institute for Materials Science, 1-2-1 Sengen, Tsukuba, Ibaraki 305-0047, Japan.
Wang H; Waseda University, 3-4-1 Ookubo, Shinjuku-ku, Tokyo 169-8555, Japan.
Song M; National Institute of Advanced Industrial Science and Technology, 16-1 Onogawa, Tsukuba, Ibaraki 305-8569, Japan.
Guan S; Tsinghua University, 30 Shuangqing Road, Haidian, Beijing 100084, China.
Ogura A; Beijing Institute of Technology, 5 South Street, Zhongguancun, Haidian, Beijing 100081, China.
Watanabe T; Toyo University, 2100 Kujirai, Kawagoe, Saitama 350-8585, Japan.