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Thermoelectric properties of n-type Cu4Sn7S16-based compounds.
Deng, Tingting; Wei, Tian-Ran; Song, Qingfeng; Xu, Qing; Ren, Dudi; Qiu, Pengfei; Shi, Xun; Chen, Lidong.
Afiliação
  • Deng T; State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences Shanghai 200050 China wtr@mail.sic.ac.cn xshi@mail.sic.ac.cn.
  • Wei TR; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences Beijing 100049 China.
  • Song Q; School of Physical Science and Technology, ShanghaiTech University Shanghai 201210 China.
  • Xu Q; State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences Shanghai 200050 China wtr@mail.sic.ac.cn xshi@mail.sic.ac.cn.
  • Ren D; State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences Shanghai 200050 China wtr@mail.sic.ac.cn xshi@mail.sic.ac.cn.
  • Qiu P; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences Beijing 100049 China.
  • Shi X; State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences Shanghai 200050 China wtr@mail.sic.ac.cn xshi@mail.sic.ac.cn.
  • Chen L; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences Beijing 100049 China.
RSC Adv ; 9(14): 7826-7832, 2019 Mar 06.
Article em En | MEDLINE | ID: mdl-35521165

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article