Test Structure Design for Defect Detection during Active Thermal Cycling.

Florea, Ciprian; Simon, Dan; BojiÈa, Adrian; Purcar, Marius; Boianceanu, Cristian; Èopa, Vasile

Florea, Ciprian; Simon, Dan; BojiÈa, Adrian; Purcar, Marius; Boianceanu, Cristian; Èopa, Vasile.

Afiliação

Florea C; Infineon Technologies Romania & Co. SCS, 020335 Bucharest, Romania.
Simon D; Electrotechnics and Measurements Department, Technical University of Cluj-Napoca, 400027 Cluj-Napoca, Romania.
BojiÈa A; Infineon Technologies Romania & Co. SCS, 020335 Bucharest, Romania.
Purcar M; Electrotechnics and Measurements Department, Technical University of Cluj-Napoca, 400027 Cluj-Napoca, Romania.
Boianceanu C; Electrotechnics and Measurements Department, Technical University of Cluj-Napoca, 400027 Cluj-Napoca, Romania.
Èopa V; Infineon Technologies Romania & Co. SCS, 020335 Bucharest, Romania.

Sensors (Basel) ; 22(19)2022 Sep 23.

Article em En | MEDLINE | ID: mdl-36236320

Palavras-chave

DMOS power transistor; active thermal cycling; electro-thermal; failure mechanisms; integrated sensors; metallization fatigue; smart power IC; test structure; thermo-mechanical

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Texto completo: 1 Base de dados: MEDLINE Tipo de estudo: Diagnostic_studies Idioma: En Ano de publicação: 2022 Tipo de documento: Article

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Texto completo: 1 Base de dados: MEDLINE Tipo de estudo: Diagnostic_studies Idioma: En Ano de publicação: 2022 Tipo de documento: Article