The Effect of Polyepoxyphenylsilsesquioxane and Diethyl Bis(2-hydroxyethyl)aminomethylphosphonate on the Thermal Stability of Epoxy Resin.

Zhou, Rongfan; Wu, Xintong; Bao, Xiaohui; Wu, Fangyi; Han, Xiaoshuai; Wang, Jiangbo.

Afiliação

Zhou R; School of Materials and Chemical Engineering, Ningbo University of Technology, Ningbo315211, China.
Wu X; School of Materials and Chemical Engineering, Ningbo University of Technology, Ningbo315211, China.
Bao X; School of Materials and Chemical Engineering, Ningbo University of Technology, Ningbo315211, China.
Wu F; School of Materials and Chemical Engineering, Ningbo University of Technology, Ningbo315211, China.
Han X; Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, International Innovation Center for Forest Chemicals and Materials, College of Materials Science and Engineering, Nanjing Forestry University, Nanjing210037, China.
Wang J; School of Materials and Chemical Engineering, Ningbo University of Technology, Ningbo315211, China.

ACS Omega ; 8(2): 2077-2084, 2023 Jan 17.

Article em En | MEDLINE | ID: mdl-36687112

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article