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Ultrathin, soft, radiative cooling interfaces for advanced thermal management in skin electronics.
Li, Jiyu; Fu, Yang; Zhou, Jingkun; Yao, Kuanming; Ma, Xue; Gao, Shouwei; Wang, Zuankai; Dai, Jian-Guo; Lei, Dangyuan; Yu, Xinge.
Afiliação
  • Li J; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Fu Y; Hong Kong Center for Cerebra-Cardiovascular Health Engineering, Hong Kong Science Park, New Territories 999077, Hong Kong, China.
  • Zhou J; Department of Materials Science and Engineering, The Hong Kong Institute of Clean Energy, City University of Hong Kong, 83 Tat Chee Avenue, Hong Kong, China.
  • Yao K; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Ma X; Hong Kong Center for Cerebra-Cardiovascular Health Engineering, Hong Kong Science Park, New Territories 999077, Hong Kong, China.
  • Gao S; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Wang Z; Department of Materials Science and Engineering, The Hong Kong Institute of Clean Energy, City University of Hong Kong, 83 Tat Chee Avenue, Hong Kong, China.
  • Dai JG; Department of Mechanical Engineering, City University of Hong Kong, Kowloon, Hong Kong, China.
  • Lei D; Department of Mechanical Engineering, City University of Hong Kong, Kowloon, Hong Kong, China.
  • Yu X; Department of Civil and Environmental Engineering, The Hong Kong Polytechnic University, Hong Kong, China.
Sci Adv ; 9(14): eadg1837, 2023 04 07.
Article em En | MEDLINE | ID: mdl-37027471
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Texto completo: 1 Base de dados: MEDLINE Assunto principal: Dispositivos Eletrônicos Vestíveis Idioma: En Ano de publicação: 2023 Tipo de documento: Article
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Dispositivos Eletrônicos Vestíveis Idioma: En Ano de publicação: 2023 Tipo de documento: Article