Topology optimization for near-junction thermal spreading of electronics in ballistic-diffusive regime.

Tang, Zheng-Lai; Shen, Yang; Li, Han-Ling; Cao, Bing-Yang.

Afiliação

Tang ZL; Key Laboratory of Thermal Science and Power Engineering of Education of Ministry, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
Shen Y; Key Laboratory of Thermal Science and Power Engineering of Education of Ministry, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
Li HL; Key Laboratory of Thermal Science and Power Engineering of Education of Ministry, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
Cao BY; Key Laboratory of Thermal Science and Power Engineering of Education of Ministry, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.

iScience ; 26(7): 107179, 2023 Jul 21.

Article em En | MEDLINE | ID: mdl-37485369