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Achieving tissue-level softness on stretchable electronics through a generalizable soft interlayer design.
Li, Yang; Li, Nan; Liu, Wei; Prominski, Aleksander; Kang, Seounghun; Dai, Yahao; Liu, Youdi; Hu, Huawei; Wai, Shinya; Dai, Shilei; Cheng, Zhe; Su, Qi; Cheng, Ping; Wei, Chen; Jin, Lihua; Hubbell, Jeffrey A; Tian, Bozhi; Wang, Sihong.
Afiliação
  • Li Y; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Li N; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Liu W; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Prominski A; Department of Chemistry, The University of Chicago, Chicago, IL, 60637, USA.
  • Kang S; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Dai Y; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Liu Y; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Hu H; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Wai S; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Dai S; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Cheng Z; Department of Chemistry, The University of Chicago, Chicago, IL, 60637, USA.
  • Su Q; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Cheng P; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Wei C; Department of Mechanical and Aerospace Engineering, University of California Los Angeles, Los Angeles, CA, 90095, USA.
  • Jin L; Department of Mechanical and Aerospace Engineering, University of California Los Angeles, Los Angeles, CA, 90095, USA.
  • Hubbell JA; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA.
  • Tian B; Department of Chemistry, The University of Chicago, Chicago, IL, 60637, USA.
  • Wang S; Pritzker School of Molecular Engineering, The University of Chicago, Chicago, IL, 60637, USA. sihongwang@uchicago.edu.
Nat Commun ; 14(1): 4488, 2023 07 26.
Article em En | MEDLINE | ID: mdl-37495580
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Texto completo: 1 Base de dados: MEDLINE Assunto principal: Dispositivos Eletrônicos Vestíveis Limite: Humans Idioma: En Ano de publicação: 2023 Tipo de documento: Article
Texto completo
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Texto completo: 1 Base de dados: MEDLINE Assunto principal: Dispositivos Eletrônicos Vestíveis Limite: Humans Idioma: En Ano de publicação: 2023 Tipo de documento: Article