Highly lithiophilic and structurally stable Cu-Zn alloy skeleton for high-performance Li-rich ternary anodes.

Xing, Jianxiong; Yan, Luo; Chen, Tao; Song, Zhicui; Wang, Zihao; Liu, Yuchi; Zhou, Liujiang; Li, Jingze

Xing, Jianxiong; Yan, Luo; Chen, Tao; Song, Zhicui; Wang, Zihao; Liu, Yuchi; Zhou, Liujiang; Li, Jingze.

Afiliação

Xing J; School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, PR China; Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China, Huzhou 313001, PR China.
Yan L; School of Physics, University of Electronic Science and Technology of China, Chengdu 610054, PR China.
Chen T; School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, PR China; School of Electronic Engineering, Chengdu Technological University, Chengdu 611730, PR China.
Song Z; School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, PR China; Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China, Huzhou 313001, PR China.
Wang Z; School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, PR China; Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China, Huzhou 313001, PR China.
Liu Y; School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, PR China; Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China, Huzhou 313001, PR China.
Zhou L; School of Physics, University of Electronic Science and Technology of China, Chengdu 610054, PR China.
Li J; School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, PR China; Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China, Huzhou 313001, PR China. Electronic address: lijingze@uestc.edu.cn.

J Colloid Interface Sci ; 652(Pt A): 627-635, 2023 Dec 15.

Article em En | MEDLINE | ID: mdl-37586949