Mode I Fatigue and Fracture Assessment of Polyimide-Epoxy and Silicon-Epoxy Interfaces in Chip-Package Components.

Morais, Pedro; Akhavan-Safar, Alireza; Carbas, Ricardo J C; Marques, Eduardo A S; Karunamurthy, Bala; da Silva, Lucas F M.

Afiliação

Morais P; Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal.
Akhavan-Safar A; Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), Rua Dr. Roberto Frias, 4200-465 Porto, Portugal.
Carbas RJC; Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), Rua Dr. Roberto Frias, 4200-465 Porto, Portugal.
Marques EAS; Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal.
Karunamurthy B; Infineon Technologies Austria AG, Siemensstrasse 2, 9500 Villach, Austria.
da Silva LFM; Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal.

Polymers (Basel) ; 16(4)2024 Feb 07.

Article em En | MEDLINE | ID: mdl-38399841