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The Mechanism of Short-Circuit Oscillations in Automotive-Grade Multi-Chip Parallel Power Modules and an Effective Mitigation Approach.
Ma, Kun; Sun, Yameng; Liu, Xun; Song, Yifan; Li, Xuehan; Shi, Huimin; Feng, Zheng; Zhang, Xiao; Zhou, Yang; Liu, Sheng.
Afiliação
  • Ma K; Institute of Technological Sciences, Wuhan University, Wuhan 430072, China.
  • Sun Y; Institute of Technological Sciences, Wuhan University, Wuhan 430072, China.
  • Liu X; Institute of Technological Sciences, Wuhan University, Wuhan 430072, China.
  • Song Y; School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430070, China.
  • Li X; School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430070, China.
  • Shi H; Hefei Archimedes Electronic Technology Co., Ltd., Hefei 230000, China.
  • Feng Z; Hefei Archimedes Electronic Technology Co., Ltd., Hefei 230000, China.
  • Zhang X; Institute of Technological Sciences, Wuhan University, Wuhan 430072, China.
  • Zhou Y; Hefei Archimedes Electronic Technology Co., Ltd., Hefei 230000, China.
  • Liu S; Institute of Technological Sciences, Wuhan University, Wuhan 430072, China.
Sensors (Basel) ; 24(9)2024 Apr 30.
Article em En | MEDLINE | ID: mdl-38732966
ABSTRACT
This paper presents an in-depth analysis of the oscillation phenomenon occurring in multi-chip parallel automotive-grade power modules under short-circuit conditions and investigates three suppression methods. We tested and analyzed two commercial automotive-grade power modules, one containing two chips and the other containing a single chip, and found that short-circuit gate oscillations were more likely to occur in multi-chip parallel packaged modules than in single-chip packaged modules. Through experimental and simulation analyses, we observed that gate oscillations were mainly caused by the interaction between internal parasitic parameters of the module and the external drive circuit, and we found that high drive resistance and low common emitter inductance between parallel chips could effectively suppress gate voltage oscillations. We also analyzed the two mainstream suppression schemes, increasing the drive gate resistance and placing the drive capacitors in parallel. Unfortunately, we found that these suppression schemes were not ideal solutions because both schemes changed the switching characteristics of the power module. As an alternative, we propose a simple and effective solution that involves adding parallel connections between the parallel chips. Simulation calculations showed that this optimized method reduced the emitter inductance between parallel chips in the upper bridge arm by about 30% and in the lower bridge arm by 35%. Through short-circuit experiments conducted at different DC bus voltages, it has been verified that the new optimized solution effectively resolves gate oscillation issues without affecting the switching characteristics of the power module.
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2024 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2024 Tipo de documento: Article