Hardware implementation of associative memory characteristics with analogue-type resistive-switching device.

We have investigated the analogue memory characteristics of an oxide-based resistive-switching device under an electrical pulse to mimic biological spike-timing-dependent plasticity synapse characteristics. As a synaptic device, a TiN/Pr0.7Ca0.3MnO3-based resistive-switching device exhibiting excellent analogue memory characteristics was used to control the synaptic weight by applying various pulse amplitudes and cycles. Furthermore, potentiation and depression characteristics with the same spikes can be achieved by applying negative and positive pulses, respectively. By adopting complementary metal-oxide-semiconductor devices as neurons and TiN/PCMO devices as synapses, we implemented neuromorphic hardware that mimics associative memory characteristics in real time for the first time. Owing to their excellent scalability, resistive-switching devices, shows promise for future high-density neuromorphic applications.

Multi-layered NiOy/NbOx/NiOy fast drift-free threshold switch with high Ion/Ioff ratio for selector application.

NbO2 has the potential for a variety of electronic applications due to its electrically induced insulator-to-metal transition (IMT) characteristic. In this study, we find that the IMT behavior of NbO2 follows the field-induced nucleation by investigating the delay time dependency at various voltages and temperatures. Based on the investigation, we reveal that the origin of leakage current in NbOx is partly due to insufficient Schottky barrier height originating from interface defects between the electrodes and NbOx layer. The leakage current problem can be addressed by inserting thin NiOy barrier layers. The NiOy inserted NbOx device is drift-free and exhibits high Ion/Ioff ratio (>5400), fast switching speed (<2 ns), and high operating temperature (>453 K) characteristics which are highly suitable to selector application for x-point memory arrays. We show that NbOx device with NiOx interlayers in series with resistive random access memory (ReRAM) device demonstrates improved readout margin (>29 word lines) suitable for x-point memory array application.

Effects of High-Pressure Hydrogen Annealing (HPHA) on Reliability Characteristics of RRAM.

Reliability characteristics (retention and endurance) of RRAM are critical for its practical realization and need to be improved. In this work, we confirmed the trade-off between retention and endurance by using various top electrode thickness conditions. The trade-off between retention and endurance characteristics was mainly due to the different amount of oxygen in scavenging layer (Ta) and the amount of oxygen vacancy in switching layer (HfO2). The amount of the oxygen in scavenging layer (Ta) and the amount of the oxygen vacancy in switching layer (HfO2) will be increased with the increase of Ta thickness. Therefore, the thicker Ta cells have worse retention because the large amount of oxygen in scavenging layer (Ta) can diffuse back into switching layer (HfO2) and recombine with oxygen vacancies in the filament. However, it has longer endurance because the large amount of oxygen vacancy in switching layer (HfO2) can be a source of the filament. Hence, there exists a trade-off relation between retention and endurance under the various Ta thickness conditions. To improve both retention and endurance characteristics, we proposed a new method by using high-pressure hydrogen annealing (HPHA). The thin Ta cells have longer retention and worse endurance because it has small amount of both oxygen in scavenging layer (Ta) and oxygen vacancy in switching layer (HfO2). Therefore, to generate more oxygen vacancies in switching layer (HfO2) maintaining small amount of oxygen in scavenging layer (Ta), we treated the samples by HPHA before Ta deposition. Finally, we obtained both improved retention and endurance characteristics in HfO2 based RRAM devices after high-pressure hydrogen annealing treatment.

Structurally engineered stackable and scalable 3D titanium-oxide switching devices for high-density nanoscale memory.

A 3D high-density switching device is realized utilizing titanium oxide, which is the most optimum material, but which is not practically demonstrated yet. The 1S1R (one ReRAM with the developed switching device) exhibits memory characteristics with a significantly suppressed sneak current, which can be used to realize high-density ReRAM applications.

Internal resistor of multi-functional tunnel barrier for selectivity and switching uniformity in resistive random access memory.

In this research, we analyzed the multi-functional role of a tunnel barrier that can be integrated in devices. This tunnel barrier, acting as an internal resistor, changes its resistance with applied bias. Therefore, the current flow in the devices can be controlled by a tunneling mechanism that modifies the tunnel barrier thickness for non-linearity and switching uniformity of devices. When a device is in a low-resistance state, the tunnel barrier controls the current behavior of the device because most of the bias is applied to the tunnel barrier owing to its higher resistance. Furthermore, the tunnel barrier induces uniform filament formation during set operation with the tunnel barrier controlling the current flow.

High current density and nonlinearity combination of selection device based on TaO(x)/TiO2/TaO(x) structure for one selector-one resistor arrays.

We demonstrate a high-performance selection device by utilizing the concept of crested oxide barrier to suppress the sneak current in bipolar resistive memory arrays. Using a TaO(x)/TiO(2)/TaO(x) structure, high current density over 10(7) A cm(-2) and excellent nonlinear characteristics up to 10(4) were successfully demonstrated. On the basis of the defect chemistry and SIMS depth profile result, we found that some Ta atoms gradually diffused into TiO(2) film, and consequently, the energy band of the TiO(2) film was symmetrically bent at the top and bottom TaO(x)/TiO(2) interfaces and modified as a crested oxide barrier. Furthermore, the one selector-one resistor device exhibited significant suppression of the leakage current, indicating excellent selector characteristics.