Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology.

In this study, through silicon via (TSV)-less interconnection using the fan-out wafer-level-packaging (FO-WLP) technology and a novel redistribution layer (RDL)-first wafer level packaging are investigated. Since warpage of molded wafer is a critical issue and needs to be optimized for process integration, the evaluation of the warpage issue on a 12-inch wafer using finite element analysis (FEA) at various parameters is presented. Related parameters include geometric dimension (such as chip size, chip number, chip thickness, and mold thickness), materials' selection and structure optimization. The effect of glass carriers with various coefficients of thermal expansion (CTE) is also discussed. Chips are bonded onto a 12-inch reconstituted wafer, which includes 2 RDL layers, 3 passivation layers, and micro bumps, followed by using epoxy molding compound process. Furthermore, an optical surface inspector is adopted to measure the surface profile and the results are compared with the results from simulation. In order to examine the quality of the TSV-less interconnection structure, electrical measurement is conducted and the respective results are presented.

Development and Performance Evaluation of Integrated Hybrid Power Module for Three-Phase Servo Motor Applications.

This study aims to develop a 30 kHz/12 kW silicon carbide (SiC)/Si integrated hybrid power module (iHPM) for variable frequency drive applications, particularly industrial servo motor control, and, additionally, to theoretically and experimentally assess its dynamic characteristics and efficiency during operation. This iHPM integrates a brake circuit, a three-phase Si rectifier, and a three-phase SiC inverter within a single package to achieve a minimal current path. A space-vector pulse width modulation (SVPWM) scheme is used to control the inverter power switches. In order to reduce parasitic inductance and power loss, an inductance cancellation design is implemented in the Si rectifier and SiC inverter. The switching transients and their parasitic effects during a three-phase operation are assessed through an electromagnetic-circuit co-simulation model, by which the power loss and efficiency of the iHPM are estimated. The modeled parasitic inductance of the inverter is validated through inductance measurement, and the effectiveness of the simulated results in terms of switching transients and efficiency is verified using the experimental results of the double pulse test and open-loop inverter operation, respectively. In addition, the power loss and efficiency of the SiC MOSFET inverter are experimentally compared against those of a commercial Si IGBT inverter.

A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps.

Microbumps in three-dimensional integrated circuit now becomes essential technology to reach higher packaging density. However, the small volume of microbumps dramatically changes the characteristics from the flip-chip (FC) solder joints. For a 20 µm diameter microbump, the cross-section area and the volume are only 1/25 and 1/125 of a 100 µm diameter FC joint. The small area significantly enlarges the current density although the current crowding effect was reduced at the same time. The small volume of solder can be fully transformed into the intermetallic compounds (IMCs) very easily, and the IMCs are usually stronger under electromigration (EM). These result in the thoroughly change of the EM failure mechanism in microbumps. In this study, microbumps with two different diameter and flip-chip joints were EM tested. A new failure mechanism was found obviously in microbumps, which is the surface diffusion of Sn. Under EM testing, Sn atoms tend to migrate along the surface to the circumference of Ni and Cu metallization to form Ni3Sn4 and Cu3Sn IMCs respectively. When the Sn diffuses away, necking or serious void formation occurs in the solder, which weakens the electrical and mechanical properties of the microbumps. Theoretic calculation indicates that this failure mode will become even significantly for the microbumps with smaller dimensions than the 18 µm microbumps.

Synthesis of nanosized chitosan-poly(acrylic acid) particles by a dropping method.

Deoxyribonucleic acid (DNA) vaccines are being investigated extensively because of their excellent potential over conventional protein ones. A suitable DNA carrier, consisting of uniformly dispersed chitosan-poly(acrylic acid) particles with an average size of 30 nm, was successfully synthesized by a dropping method with a ratio of chitosan solution to poly(acrylic acid) solution of 1:1 and was incubated in a buffer solution with a pH value of 3.0. The particle size increased from 35.76 to 45.90 nm when the pH value of the buffer solution was increased from 3.0 to 7.4. After freeze-drying, the non-incubated mixed solution showed a membranous morphology. A powdered product was formed from the mixed solution as incubated in buffer solution with pH values of 3.0 and 5.3. However, when the mixed solution was incubated in a buffer solution of pH 7.4, a mixture of membrane and powder was obtained.