Microstructural engineering in interface-type synapse device for enhancing linear and symmetric conductance changes.

The origins of the nonlinear and asymmetric synaptic characteristics of TiO x -based synapse devices were investigated. Based on the origins, a microstructural electrode was utilized to improve the synaptic characteristics. Under an identical pulse bias, a TiO x -based synapse device exhibited saturated conductance changes, which led to nonlinear and asymmetric synaptic characteristics. The formation of an interfacial layer between the electrode and TiO x layer, which can limit consecutive oxygen migration and chemical reactions, was considered as the main origin of the conductance saturation behavior. To achieve consecutive oxygen migration and chemical reactions, structural engineering was utilized. The resultant microstructural electrode noticeably improved the synaptic characteristics, including the unsaturated, linear, and symmetric conductance changes. These synaptic characteristics resulted in the recognition accuracy significantly increasing from 38% to 90% in a neural network-based pattern recognition simulation.

A C-Te-based binary OTS device exhibiting excellent performance and high thermal stability for selector application.

In this letter, we demonstrate a new binary ovonic threshold switching (OTS) selector device scalable down to ø30 nm based on C-Te. Our proposed selector device exhibits outstanding performance such as a high switching ratio (Ion/Ioff > 105), an extremely low off-current (∼1 nA), an extremely fast operating speed of <10 ns (transition time of <2 ns and delay time of <8 ns), high endurance (109), and high thermal stability (>450 °C). The observed high thermal stability is caused by the relatively small atomic size of C, compared to Te, which can effectively suppress the segregation and crystallization of Te in the OTS film. Furthermore, to confirm the functionality of the selector in a crossbar array, we evaluated a 1S-1R device by integrating our OTS device with a ReRAM (resistive random access memory) device. The 1S-1R integrated device exhibits a successful suppression of leakage current at the half-selected cell and shows an excellent read-out margin (>212 word lines) in a fast read operation.

SET Kinetics of Ag/HfO2-Based Diffusive Memristors under Various Counter-Electrode Materials.

The counter-electrode (CE) material in electrochemical metallization memory (ECM) cells plays a crucial role in the switching process by affecting the reactions at the CE/electrolyte interface. This is due to the different electrocatalytic activity of the CE material towards reduction-oxidation reactions, which determines the metal ion concentration in the electrolyte and ultimately impacts the switching kinetics. In this study, the focus is laid on Pt, TiN, and W, which are relevant in standard chip technology. For these, the influence of CE metal on the switching kinetics of Ag/HfO2-based volatile ECM cells is investigated. Rectangular voltage pulses of different amplitudes were applied, and the SET times were analyzed from the transient curves. The results show that CE material has a significant effect on the SET kinetics, with differences being observed depending on the voltage regime. The formation of interfacial oxides at the CE/electrolyte interface, particularly for non-noble metals, is also discussed in relation to the findings. Overall, this work highlights the important role of the CE material in the switching process of Ag/HfO2-based diffusive memristors and the importance of considering interfacial oxide formation in the design of these devices.