Detalhe da pesquisa
1.
A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D Integration.
J Nanosci Nanotechnol
; 18(2): 1066-1069, 2018 Feb 01.
Artigo
em Inglês
| MEDLINE | ID: mdl-29448533
2.
Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer Layer.
J Nanosci Nanotechnol
; 18(8): 5397-5403, 2018 Aug 01.
Artigo
em Inglês
| MEDLINE | ID: mdl-29458591
3.
Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology.
J Nanosci Nanotechnol
; 18(8): 5558-5565, 2018 Aug 01.
Artigo
em Inglês
| MEDLINE | ID: mdl-29458610
4.
Robust terahertz polarizers with high transmittance at selected frequencies through Si wafer bonding technologies.
Opt Lett
; 42(23): 4917-4920, 2017 Dec 01.
Artigo
em Inglês
| MEDLINE | ID: mdl-29216144
5.
A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications.
Biomed Microdevices
; 17(1): 11, 2015 Feb.
Artigo
em Inglês
| MEDLINE | ID: mdl-25653056
6.
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application.
Nanomaterials (Basel)
; 13(17)2023 Sep 04.
Artigo
em Inglês
| MEDLINE | ID: mdl-37687000
7.
Effects of bonding technology and thinning process in three-dimensional integration on device characteristics.
J Nanosci Nanotechnol
; 12(10): 8050-4, 2012 Oct.
Artigo
em Inglês
| MEDLINE | ID: mdl-23421177
8.
Adhesive selection and bonding parameter optimization for hybrid bonding in 3D integration.
J Nanosci Nanotechnol
; 12(3): 1821-8, 2012 Mar.
Artigo
em Inglês
| MEDLINE | ID: mdl-22754986
9.
The fabrication of a programmable via using phase-change material in CMOS-compatible technology.
Nanotechnology
; 21(13): 134001, 2010 Apr 02.
Artigo
em Inglês
| MEDLINE | ID: mdl-20208109
10.
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV).
Nanoscale Res Lett
; 12(1): 56, 2017 Dec.
Artigo
em Inglês
| MEDLINE | ID: mdl-28105605
11.
Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes.
IEEE Trans Biomed Circuits Syst
; 11(5): 1013-1025, 2017 10.
Artigo
em Inglês
| MEDLINE | ID: mdl-28371785
12.
Sake Protein Supplementation Affects Exercise Performance and Biochemical Profiles in Power-Exercise-Trained Mice.
Nutrients
; 8(2): 106, 2016 Feb 20.
Artigo
em Inglês
| MEDLINE | ID: mdl-26907336
13.
Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu.
Sci Rep
; 5: 9734, 2015 May 12.
Artigo
em Inglês
| MEDLINE | ID: mdl-25962757
14.
Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding.
Nanoscale Res Lett
; 9(1): 541, 2014.
Artigo
em Inglês
| MEDLINE | ID: mdl-25324705
15.
Conductivity enhancement of multiwalled carbon nanotube thin film via thermal compression method.
Nanoscale Res Lett
; 9(1): 451, 2014.
Artigo
em Inglês
| MEDLINE | ID: mdl-25232300
16.
2.5D heterogeneously integrated microsystem for high-density neural sensing applications.
IEEE Trans Biomed Circuits Syst
; 8(6): 810-23, 2014 Dec.
Artigo
em Inglês
| MEDLINE | ID: mdl-25576575