Adipose-derived stem cells and ginkgo biloba extract-loaded PCL/gelatin nanofibrous scaffolds for peripheral nerve injury repair: the impact of physical activity.

Peripheral nerve damages take place as a result of trauma, compression or disease, resulting in sensory loss, impaired motor function and subsequent challenges. In the current study, ginkgo biloba extract was loaded into PCL/gelatin scaffolds through electrospinning method. The scaffolds were characterized in vitro using various studies. The prepared nanofibrous scaffolds were rolled up to make neural guidance channels. Then, the conduits were seeded with adipose-derived stem cells and transplanted into a rat model of sciatic nerve injury. The scaffolds were not toxic and had optimal tensile and suturability. The animals treated with the conduits that delivered adipose-derived stem cells and ginkgo biloba extract, and received the treadmill exercise, had significantly higher motor and sensory functions recovery. In addition, histopathological examinations showed beneficial role of the exercise plan on the nervous system repair.

Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits.

A microwave transmitter/receiver using the low-temperature co-fired ceramic substrate and ball grid array packaging demonstrates superior properties, including high integration, miniaturization, and high electromagnetic shielding. However, it holds limitations of inadequate hermeticity (that is, gas or moist impermeability), high cost, and low reproducibility. In this work, we aim to overcome these difficulties by introducing a new packing technique. The packaging utilizes an electroless plated Ni/Pd/Au surface, resulting in a significant enhancement of the packaging hermeticity by orders of magnitude, approaching the level of <5 × 10-9 Pa·m3/s. Both Sn63Pb37 and Au80Sn20 solder alloys demonstrate exceptional solderability, attributed to Pd atoms diffusing to the Au layer during soldering at 310 °C. A reliability test of the packaging shows that the shear strength of the solder balls drops after thermal shocks but negligibly affects the hermeticity of the packaging. Furthermore, a meticulously designed internal vertical interconnect structure and I/O interconnections were engineered in the ball grid array packaging, showcasing excellent transmission characteristics within the 10-40 GHz frequency range while ensuring effective isolation between ports.