Crack Initiation of Printed Lines Predicted with Digital Image Correlation.

Printing of metallic films has been preferred over vacuum technologies for roll-to-roll processes because of faster processing times and lower processing costs. Films can be produced by depositing inks containing suspended metallic particles within a solvent and then heating the films to both remove the solvent and sinter the particles. The resulting printed structure and electrical and mechanical behavior of the printed films has been studied to better understand their electro-mechanical response to loading and eventual brittle fracture. This study evaluated the electro-mechanical behavior of 1.25-µm printed Ag films using in situ resistance and in situ imaging methods. Digital image correlation was utilized with confocal laser scanning microscope images to better visualize crack initiation during tensile straining. This technique showed that cracks initiated earlier in the thicker areas of the film (crests) than in lower areas (troughs) because of a higher density of printing defects and the increased thickness.

Ductile film delamination from compliant substrates using hard overlayers.

Flexible electronic devices call for copper and gold metal films to adhere well to polymer substrates. Measuring the interfacial adhesion of these material systems is often challenging, requiring the formulation of different techniques and models. Presented here is a strategy to induce well defined areas of delamination to measure the adhesion of copper films on polyimide substrates. The technique utilizes a stressed overlayer and tensile straining to cause buckle formation. The described method allows one to examine the effects of thin adhesion layers used to improve the adhesion of flexible systems.

Detailed modelling of delamination buckling of thin films under global tension.

Tensile specimens of metal films on compliant substrates are widely used for determining interfacial properties. These properties are identified by the comparison of experimentally observed delamination buckling and a mathematical model which contains the interface properties as parameters. The current two-dimensional models for delamination buckling are not able to capture the complex stress and deformation states arising in the considered uniaxial tension test in a satisfying way. Therefore, three-dimensional models are developed in a multi-scale approach. It is shown that, for the considered uniaxial tension test, the buckling and associated delamination process are initiated and driven by interfacial shear in addition to compressive stresses in the film. The proposed model is able to reproduce all important experimentally observed phenomena, like cracking stress of the film, film strip curvature and formation of triangular buckles. Combined with experimental data, the developed computational model is found to be effective in determining interface strength properties.

An elevated temperature study of a Ti adhesion layer on polyimide.

Titanium layers are used to promote adhesion between polymer substrates for flexible electronics and the Cu or Au conducting lines. Good adhesion of conducting lines in flexible circuits is critical in improving circuit performance and increasingcircuit lifetime. Nominally 50 nm thick Ti films on polyimide (PI) are investigated by fragmentation testing under uniaxial tensile load in the as-deposited state, at 350 °C, and after annealing. The cracking and buckling of the films show clear differences between the as-deposited and the thermally treated samples, cracks are much straighter and buckles are smaller following heat treatment. These changes are correlated to a drop in adhesion of the samples following heat treatment. Adhesion values are determined from the buckle dimensions using a total energy approach as described in the work of Cordill et al. (Acta Mater. 2010). Cross-sectional transmission electron microscopy of the Ti/PI interface found evidence of a ~ 5 nm thick interlayer between the largely columnar Ti and the amorphous PI. This interlayer is amorphous in the as-deposited state but nano-crystalline in those coatings tested at elevated temperature or annealed. It is put forward that this alteration of the interfacial structure causes the reduced adhesion.

Parameters influencing the fracture of Mo films and their wider significance.

Fragmentation testing has been used for decades to assess thin film fracture and delamination. Hooke's law is generally used to determine a film fracture stress from the crack onset strain observed in micrographs or measured as an electrical resistance increase. While this method is in theory suitable in the elastic regime, it neglects important film characteristics, such as residual stress, microstructure, or film architecture. Thus, there is a need to improve fracture analysis using fragmentation to avoid significant errors in measuring fracture stress or apparent fracture toughness of thin films. In-situ X-ray diffraction fragmentation experiments can measure the film fracture stress even for individual layers being part of a multilayer. Which characteristics influence the apparent fracture behavior will be demonstrated on Mo thin films on polyimide.

Electrically reversible cracks in an intermetallic film controlled by an electric field.

Cracks in solid-state materials are typically irreversible. Here we report electrically reversible opening and closing of nanoscale cracks in an intermetallic thin film grown on a ferroelectric substrate driven by a small electric field (~0.83 kV/cm). Accordingly, a nonvolatile colossal electroresistance on-off ratio of more than 108 is measured across the cracks in the intermetallic film at room temperature. Cracks are easily formed with low-frequency voltage cycling and remain stable when the device is operated at high frequency, which offers intriguing potential for next-generation high-frequency memory applications. Moreover, endurance testing demonstrates that the opening and closing of such cracks can reach over 107 cycles under 10-µs pulses, without catastrophic failure of the film.

A versatile atomic force microscope integrated with a scanning electron microscope.

A versatile atomic force microscope (AFM), which can be installed in a scanning electron microscope (SEM), is introduced. The flexible design of the instrument enables correlated analysis for different experimental configurations, such as AFM imaging directly after nanoindentation in vacuum. In order to demonstrate the capabilities of the specially designed AFM installed inside a SEM, slip steps emanating around nanoindents in single crystalline brass were examined. This example showcases how the combination of AFM and SEM imaging can be utilized for quantitative dislocation analysis through the measurement of the slip step heights without the hindrance of oxide formation. Finally, an in situ nanoindentation technique is introduced, illustrating the use of AFM imaging during indentation experiments to examine plastic deformation occurring under the indenter tip. The mechanical indentation data are correlated to the SEM and AFM images to estimate the number of dislocations emitted to the surface.