A load-lock compatible system for in situ electrical resistivity measurements during thin film growth.

An experimental setup designed for in situ electrical resistance measurement during thin film growth is described. The custom-built sample holder with a four-point probe arrangement can be loaded into a high-vacuum magnetron sputter-deposition chamber through a load-lock transfer system, allowing measurements on series of samples without venting the main chamber. Electrical contact is ensured with circular copper tracks inserted in a Teflon plate on a mounting holder station inside the deposition chamber. This configuration creates the possibility to measure thickness-dependent electrical resistance changes with sub-monolayer resolution and is compatible with use of sample rotation during growth. Examples are presented for metallic films with high adatom mobility growing in a Volmer-Weber mode (Ag and Pd) as well as for refractory metal (Mo) with low adatom mobility. Evidence for an amorphous-to-crystalline phase transition at a film thickness of 2.6 nm is reported during growth of Mo on an amorphous Si underlayer, supporting previous findings based on in situ wafer curvature measurements.

An experimental UHV AFM-STM device for characterizing surface nanostructures under stress/strain at variable temperature.

A compression setup fully integrated in an ultra high vacuum chamber is presented. The system has been designed to combine in situ mechanical test together with near field microscopy at variable temperature, from 90 to 600 K. Compressive stress can be applied on the samples up to 500 MPa at different strain rates ranging from 10(-6) s(-1) to 10(-2) s(-1). The setup performances are highlighted through investigations on Au and Ni3(Al,Ta) single crystals. In particular, it is demonstrated that the high mechanical stability of the original apparatus allows us to follow in situ the evolution of the same area of interest over a large range of temperature and to keep the high spatial resolution offered by near field microscopy, even at high strain levels.

Development of a synchrotron biaxial tensile device for in situ characterization of thin films mechanical response.

We have developed on the DIFFABS-SOLEIL beamline a biaxial tensile machine working in the synchrotron environment for in situ diffraction characterization of thin polycrystalline films mechanical response. The machine has been designed to test compliant substrates coated by the studied films under controlled, applied strain field. Technological challenges comprise the sample design including fixation of the substrate ends, the related generation of a uniform strain field in the studied (central) volume, and the operations from the beamline pilot. Preliminary tests on 150 nm thick W films deposited onto polyimide cruciform substrates are presented. The obtained results for applied strains using x-ray diffraction and digital image correlation methods clearly show the full potentialities of this new setup.