Orientation-controlled growth and optical properties of diverse Ag nanoparticles on Si(100) and Si(111) wafers.

Well-controlled growth of Ag nanoparticles (NPs) on Si substrates is important for next generation Si-based optoelectronic devices, but only randomly oriented Ag NPs have been previously reported. In this work, well-oriented Ag NPs with regular shapes are pseudomorphically grown on Si(100) and Si(111) substrates with crystallographic relationships of {100} mathematical left angle bracket 010 mathematical right angle bracket Ag ∥ {100} mathematical left angle bracket 010 mathematical right angle bracket Si and {111} mathematical left angle bracket 110 mathematical right angle bracket Ag ∥ {111} mathematical left angle bracket 110 mathematical right angle bracket Si, respectively. From a cross-sectional image, the Ag NPs on Si(100) substrates penetrate into Si and generate an inverted pyramid-like structure terminated by {111} planes embedded in Si substrates. In contrast, the Ag NPs on Si(111) substrates show flat morphology with the top plane terminated by Ag {111}. The Si underneath Ag NPs was not penetrated by Ag and a SiO(2) layer was formed between Ag and Si. Photoluminescence spectra of the Ag NPs show ultraviolet emissions centered in the 340-343 nm range. The mathematical left angle bracket 111 mathematical right angle bracket-oriented Ag particles show stronger emissions with an extra peak at 343 nm compared with mathematical left angle bracket 100 mathematical right angle bracket-oriented Ag NPs. Raman spectra show that the mathematical left angle bracket 100 mathematical right angle bracket - and mathematical left angle bracket 111 mathematical right angle bracket-oriented Ag NPs can enhance the peak intensity of Si(100) and Si(111) by 45.3% and 32.5%, respectively. The orientation-controlled Ag NPs with anisotropic optical properties are promising materials for Si-based optoelectronics.

Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application.

Advanced packaging technology has become more and more important in the semiconductor industry because of the benefits of higher I/O density compared to conventional soldering technology. In advanced packaging technology, copper-copper (Cu-Cu) bonding has become the preferred choice due to its excellent electrical and thermal properties. However, one of the major challenges of Cu-Cu bonding is the high thermal budget of the bonding process caused by Cu oxidation, which can result in wafer warpage and other back-end-of-line process issues in some cases. Thus, for specific applications, reducing the thermal budget and preventing Cu oxidation are important considerations in low-temperature hybrid bonding processes. This paper first reviews the advancements in low-temperature Cu-based bonding technologies for advanced packaging. Various low-temperature Cu-Cu bonding techniques such as surface pretreatment, surface activation, structure modification, and orientation control have been proposed and investigated. To overcome coplanarity issues of Cu pillars and insufficient gaps for filling, low-temperature Cu-Cu bonding used, but it is still challenging in fine-pitch applications. Therefore, low-temperature Cu/SiO2, Cu/SiCN, and Cu/polymer hybrid bonding have been developed for advanced packaging applications. Furthermore, we present a novel hybrid bonding scheme for metal/polymer interfaces that achieves good flatness and an excellent bonding interface without the need for the chemical mechanical polishing (CMP) process.

The Effect of Single-Dose Ougan Juice Application on the Pharmacokinetics of Erlotinib.

The aim of our study was to investigate the effects of single-dose Ougan (Citrus reticulata cv. Suavissima) juice application on the pharmacokinetics of erlotinib in vivo. Twelve Sprague-Dawley rats were randomly divided into the Ougan juice and control groups (n = 6 each). The rats were given a single dose of 1 mL/100 g Ougan juice or 1 mL/100 g normal saline (NS) by intragastric administration, followed by a single oral administration of 20 mg/kg erlotinib. The plasma concentration of erlotinib in rats was determined using ultra performance liquid chromatography-tandem mass spectrometry (UPLC-MS/MS). Erlotinib-d6 was used as the internal standard for chromatographic analysis on the UPLC BEH C18 analysis column (2.1 mm × 50 mm, 1.7 µm). The mobile phase was composed of acetonitrile and 0.1% formic acid eluting by gradient. Different pharmacokinetic (PK) parameters of erlotinib were calculated. The Ougan juice promoted the absorption of erlotinib and reduced the clearance of the drug. The area under the curve of erlotinib in the single-dose Ougan juice pretreatment group was approximately 1.87 times higher, and the maximum blood concentration (Cmax) was approximately 1.34 times higher than that in the control group. The mean residence time of erlotinib in the Ougan juice group was larger, and the clearance rate was smaller than those in the control group; the difference was statistically significant (P < 0.05). Ougan juice affected the PK spectrum of erlotinib in rats by improving the bioavailability of the drug and significantly increasing its plasma concentration.