Direct probe of heterojunction effects upon photoconductive properties of TiO2 nanotubes fabricated by atomic layer deposition.

This study investigated Schottky- and ohmic-contact effects upon the photoresponses of ITO/TiO(2)/Si and Ti/TiO(2)/Si nanotube-based photodiodes. The TiO(2) tube arrays were fabricated by atomic layer deposition (ALD) and shaped by an anodic aluminum oxide (AAO) template on a p-type Si substrate. The contact area between the electrode (Ti or ITO) and the TiO(2)'s tip was varied by tuning the tube's inner wall thickness with ALD, providing a direct and systematic probe of the heterojunction effects upon the photodiodes' responses. Results show that the Ti/TiO(2)/Si diode exhibits a highly thickness-dependent photoresponse. This is because the photocurrent is driven by the p-n junction at TiO(2)/Si alone and it faces no retarding at the ohmic contact of Ti/TiO(2). For the ITO/TiO(2)/Si diode, the Schottky contact at ITO/TiO(2) regulates photocurrent overriding TiO(2)/Si as a result of higher efficiency in photogeneration, leading to the opposite response compared with the Ti/TiO(2)/Si diode. Respective energy band diagrams are provided to support the statements above, and a consistent picture is obtained for both time response and quantum efficiency measurements.

Fabrication and characteristics of highly [Formula: see text]-oriented nanotwinned Au films.

Fine grained and nanotwinned Au has many excellent properties and is widely used in electronic devices. We have fabricated [Formula: see text] preferred-oriented Au thin films by DC plating at 5 mA/cm2. Microstructure analysis of the films show a unique fine grain structure with a twin formation. Hardness tests performed on electroplated [Formula: see text] Au films show a hardness 47% greater than random and untwinned Au. We then achieved direct bonding between two Au [Formula: see text] surfaces operating at 200 °C for an hour in a vacuum oven. The highly-oriented [Formula: see text] nanotwinned Au films could be an ideal material in many gold products.

Superparamagnetic and ferromagnetic Ni nanorod arrays fabricated on Si substrates using electroless deposition.

The microstructures and magnetic properties of nickel nanorods fabricated using an anodic alumina oxide template and electroless deposition were investigated. The as-deposited nanorods were found to contain nanocrystalline grains with an average size of approximately 2-3 nm. The temperature-dependent magnetic hysteresis curves indicated superparamagnetic behavior of the as-deposited rods as a result of the reduction of ferromagnetic crystallites. The superparamagnetic (SM) Ni nanorods transformed into ferromagnetic (FM) ones when annealed at 400 degrees C. Results from dark-field transmission electron microscopy reveal that the microstructure of the rods tends to form a laminar structure with grain growth parallel to the long axis of the rods, together with the enhancement of ferromagnetic ordering along the same direction. The results suggest that the SM-FM phase transition obtained is microstructure driven. The Ni nanorods manufactured by the electroless deposition also have the potential to serve as magnetic building blocks in nanoscale devices, such as high-frequency inductors. On-chip magnetic spiral inductors were fabricated using these nanorods, and it was demonstrated that the nanorods can enhance inductance up to 6 GHz.

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu.

Direct Cu-to-Cu bonding was achieved at temperatures of 150-250 °C using a compressive stress of 100 psi (0.69 MPa) held for 10-60 min at 10(-3) torr. The key controlling parameter for direct bonding is rapid surface diffusion on (111) surface of Cu. Instead of using (111) oriented single crystal of Cu, oriented (111) texture of extremely high degree, exceeding 90%, was fabricated using the oriented nano-twin Cu. The bonded interface between two (111) surfaces forms a twist-type grain boundary. If the grain boundary has a low angle, it has a hexagonal network of screw dislocations. Such network image was obtained by plan-view transmission electron microscopy. A simple kinetic model of surface creep is presented; and the calculated and measured time of bonding is in reasonable agreement.

Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu.

We investigate the growth of Cu films on two different Cu seed layers: one with regular <111>-oriented grains and the other with very strong <111>-preferred orientation. It is found that densely-packed nanotwinned Cu (nt-Cu) can be grown by pulsed electroplating on the strong <111>-oriented Cu seed layer without a randomly-oriented transition layer between the nt-Cu and the Cu seed layer. The electroplated nt-Cu grow almost epitaxially on the seed layer and formed <111>-oriented columnar structures. However, with the regular <111>-oriented Cu seed, there is a randomly-oriented transition layer between the nt-Cu and the regular <111>-oriented Cu seed. The results indicate that the seed layer plays a crucial role on the regularity of <111>-oriented nanotwinned Cu.

Effect of geometric nanostructures on the absorption edges of 1-D and 2-D TiO2 fabricated by atomic layer deposition.

2-Dimensional (2-D) TiO2 thin films and 1-dimensional (1-D) TiO2 nanotube arrays were fabricated on Si and quartz substrates using atomic layer deposition (ALD) with an anodic aluminum oxide (AAO) template at 400 °C. The film thickness and the tube wall thickness can be precisely controlled using the ALD approach. The intensities of the absorption spectra were enhanced by an increase in the thickness of the TiO2 thin film and tube walls. A blue-shift was observed for a decrease in the 1-D and 2-D TiO2 nanostructure thicknesses, indicating a change in the energy band gap with the change in the size of the TiO2 nanostructures. Indirect and direct interband transitions were used to investigate the change in the energy band gap. The results indicate that both quantum confinement and interband transitions should be considered when the sizes of 1-D and 2-D TiO2 nanostructures are less than 10 nm.

The heterojunction effects of TiO2 nanotubes fabricated by atomic layer deposition on photocarrier transportation direction.

The heterojunction effects of TiO2 nanotubes on photoconductive characteristics were investigated. For ITO/TiO2/Si diodes, the photocurrent is controlled either by the TiO2/Si heterojunction (p-n junction) or the ITO-TiO2 heterojunction (Schottky contact). In the short circuit (approximately 0 V) condition, the TiO2-Si heterojunction dominates the photocarrier transportation direction due to its larger space-charge region and potential gradient. The detailed transition process of the photocarrier direction was investigated with a time-dependent photoresponse study. The results showed that the diode transitioned from TiO2-Si heterojunction-controlled to ITO-TiO2 heterojunction-controlled as we applied biases from approximately 0 to -1 V on the ITO electrode.

Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper.

Highly oriented [111] Cu grains with densely packed nanotwins have been fabricated by direct-current electroplating with a high stirring rate. The [111]-oriented and nanotwinned Cu (nt-Cu) allow for the unidirectional growth of Cu(6)Sn(5) intermetallics in the microbumps of three-dimensional integrated-circuit packaging; a uniform microstructure in a large number of microbumps of controlled orientation can be obtained. The high-density twin boundaries in the nt-Cu serve as vacancy sinks during the solid-state reaction between Pb-free solder and Cu and greatly reduce the formation of Kirkendall (or Frenkel) voids.