Determination of Stiffness and the Elastic Modulus of 3D-Printed Micropillars with Atomic Force Microscopy-Force Spectroscopy.

Nowadays, many applications in diverse fields are taking advantage of micropillars such as optics, tribology, biology, and biomedical engineering. Among them, one of the most attractive is three-dimensional microelectrode arrays for in vivo and in vitro studies, such as cellular recording, biosensors, and drug delivery. Depending on the application, the micropillar's optimal mechanical response ranges from soft to stiff. For long-term implantable devices, a mechanical mismatch between the micropillars and the biological tissue must be avoided. For drug delivery patches, micropillars must penetrate the skin without breaking or bending. The accurate mechanical characterization of the micropillar is pivotal in the fabrication and optimization of such devices, as it determines whether the device will fail or not. In this work, we demonstrate an experimental method based only on atomic force microscopy-force spectroscopy that allows us to measure the stiffness of a micropillar and the elastic modulus of its constituent material. We test our method with four different types of 3D inkjet-printed micropillars: silver micropillars sintered at 100 and 150 °C and polyacrylate microstructures with and without a metallic coating. The estimated elastic moduli are found to be comparable with the corresponding bulk values. Furthermore, our findings show that neither the sintering temperature nor the presence of a thin metal coating plays a major role in defining the mechanical properties of the micropillar.

In Situ Force Microscopy to Investigate Fracture in Stretchable Electronics: Insights on Local Surface Mechanics and Conductivity.

Stretchable conductors are of crucial relevance for emerging technologies such as wearable electronics, low-invasive bioelectronic implants, or soft actuators for robotics. A critical issue for their development regards the understanding of defect formation and fracture of conducting pathways during stress-strain cycles. Here we present a combination of atomic force microscopy (AFM) methods that provides multichannel images of surface morphology, conductivity, and elastic modulus during sample deformation. To develop the method, we investigate in detail the mechanical interactions between the AFM tip and a stretched, free-standing thin film sample. Our findings reveal the conditions to avoid artifacts related to sample bending modes or resonant excitations. As an example, we analyze strain effects in thin gold films deposited on a soft silicone substrate. Our technique allows one to observe the details of microcrack opening during tensile strain and their impact on local current transport and surface mechanics. We find that although the film fractures into separate fragments, at higher strain a current transport is sustained by a tunneling mechanism. The microscopic observation of local defect formation and their correlation to local conductivity will provide insight into the design of more robust and fatigue resistant stretchable conductors.

Atomic Force Microscopy Nanomechanics of Hard Nanometer-Thick Films on Soft Substrates: Insights into Stretchable Conductors.

The nanomechanical properties of ultrathin and nanostructured films of rigid electronic materials on soft substrates are of crucial relevance to realize materials and devices for stretchable electronics. Of particular interest are bending deformations in buckled nanometer-thick films or patterned networks of rigid materials as they can be exploited to compensate for the missing tensile elasticity. Here, we perform atomic force microscopy indentation experiments and electrical measurements to characterize the nanomechanics of ultrathin gold films on a polydimethylsiloxane (PDMS) elastomer. The measured force-indentation data can be analyzed in terms of a simple analytical model describing a bending plate on a semi-infinite soft substrate. The resulting method enables us to quantify the local Young's modulus of elasticity of the nanometer-thick film. Systematic variation of the gold layer thickness reveals the presence of a diffuse interface between the metal film and the elastomer substrate that does not contribute to the bending stiffness. The effect is associated with gold clusters that penetrate the silicone and are not directly connected to the ultrathin film. Only above a critical layer thickness, percolation of the metallic thin film happens, causing a linear increase in bending stiffness and electrical conductivity.

Direct imaging of defect formation in strained organic flexible electronics by Scanning Kelvin Probe Microscopy.

The development of new materials and devices for flexible electronics depends crucially on the understanding of how strain affects electronic material properties at the nano-scale. Scanning Kelvin-Probe Microscopy (SKPM) is a unique technique for nanoelectronic investigations as it combines non-invasive measurement of surface topography and surface electrical potential. Here we show that SKPM in non-contact mode is feasible on deformed flexible samples and allows to identify strain induced electronic defects. As an example we apply the technique to investigate the strain response of organic thin film transistors containing TIPS-pentacene patterned on polymer foils. Controlled surface strain is induced in the semiconducting layer by bending the transistor substrate. The amount of local strain is quantified by a mathematical model describing the bending mechanics. We find that the step-wise reduction of device performance at critical bending radii is caused by the formation of nano-cracks in the microcrystal morphology of the TIPS-pentacene film. The cracks are easily identified due to the abrupt variation in SKPM surface potential caused by a local increase in resistance. Importantly, the strong surface adhesion of microcrystals to the elastic dielectric allows to maintain a conductive path also after fracture thus providing the opportunity to attenuate strain effects.