RESUMO
We demonstrate an advanced structure for optical interconnect consisting of 4 channel × 10 Gb/s bidirectional optical subassembly (BOSA) formed using silicon optical bench (SiOB) with tapered fiber guiding holes (TFGHs) for precise and passive optical alignment of vertical-cavity surface-emitting laser (VCSEL)-to-multi mode fiber (MMF) and MMF-to-photodiode (PD). The co-planar waveguide (CPW) transmission line (Tline) was formed on the backside of silicon substrate to reduce the insertion loss of electrical data signal. The 4 channel VCSEL and PD array are attached at the end of CPW Tline using a flip-chip bonder and solder pad. The 12-channel ribbon fiber is simply inserted into the TFGHs of SiOB and is passively aligned to the VCSEL and PD in which no additional coupling optics are required. The fabricated BOSA shows high coupling efficiency and good performance with the clearly open eye patterns and a very low bit error rate of less than 10-12 order at a data rate of 10 Gb/s with a PRBS pattern of 231-1.
RESUMO
We propose and demonstrate a new electro-absorption modulator (EAM) based on coupled tandem cavities (CTC) having asymmetric tandem quantum well (ATQW) structure with separated electrode configuration to achieve large transmittance change over a broad spectral range at low driving voltage for high definition (HD) 3D imaging applications. Our theoretical calculations show that CTC with ATQW structure can provide large transmittance change over a wide spectral range at low driving voltage. By introducing separated electrode configuration, the fabricated EAM having CTC with ATQW structure shows a large transmittance change over 50%, almost three times larger spectral bandwidth compared to that of EAM having single cavity with a single thickness quantum well without significantly increasing the applied voltage. In addition, the CTC with ATQW structure also shows high speed modulation up to 28 MHz for the device having a large area of 2 mm x 0.5 mm. This high transmittance change, large spectral bandwidth and low voltage operation over a large device area for the EAM having CTC with ATQW demonstrates their huge potential as an optical image modulator for HD 3D imaging applications.
RESUMO
We propose and analyse a GaAs-based optical switch having a ring resonator configuration which can switch optical telecommunication signals over the 1300 nm and 1500 nm bands, using bias assisted carrier injection as the switching mechanism. The switching is achieved through variation in the refractive index of the ring resonator produced by changing the injected carrier density through the application of bias voltage. Detail analysis of the switching characteristics reveals that the amount of switching depends on the refractive index change, which indeed is a strong function of injected carrier density and applied bias voltage. An isolation of 25 dB can be achieved during the ON state, while more than 40 dB isolation is realised during the OFF state. More importantly, our analysis shows that the proposed GaAs-based switch can operate over the 1300 nm and 1500 nm optical telecommunication bands, that are much farther from the bandgap of the GaAs material, without the need for "conventional" Indium based ternary and quaternary semiconductor materials. It therefore extends the usable wavelength of GaAs based optoelectronic devices. Furthermore, we have presented detail calculations to quantify power-delay metric of the proposed device. The proposed optical switch maintains a smaller footprint as when compared to Mach-Zehnder Interferometer or Directional Coupler based switches therefore, making it suitable for large scale integration and implementing next generation optical interconnects, optical communication and computing.
RESUMO
We report the fabrication of broadband antireflective silicon (Si) nanostructures fabricated using spin-coated silver (Ag) nanoparticles as an etch mask followed by inductively coupled plasma (ICP) etching process. This fabrication technique is a simple, fast, cost-effective, and high-throughput method, making it highly suitable for mass production. Prior to the fabrication of Si nanostructures, theoretical investigations were carried out using a rigorous coupled-wave analysis method in order to determine the effects of variations in the geometrical features of Si nanostructures to obtain antireflection over a broad wavelength range. The Ag ink ratio and ICP etching conditions, which can affect the distribution, distance between the adjacent nanostructures, and height of the resulting Si nanostructures, were carefully adjusted to determine the optimal experimental conditions for obtaining desirable Si nanostructures for practical applications. The Si nanostructures fabricated using the optimal experimental conditions showed a very low average reflectance of 8.3%, which is much lower than that of bulk Si (36.8%), as well as a very low reflectance for a wide range of incident angles and different polarizations over a broad wavelength range of 300 to 1,100 nm. These results indicate that the fabrication technique is highly beneficial to produce antireflective structures for Si-based device applications requiring low light reflection.
RESUMO
We report the observation of room temperature photoluminescence (PL) emission from GaAs/GaInAs core-multiple-quantum-well (MQW) shell nanowires (NWs) surrounded by AlGaAs grown by molecular beam epitaxy (MBE) using a self-catalyzed technique. PL spectra of the sample show two PL peaks, originating from the GaAs core NWs and the GaInAs MQW shells. The PL peak from the shell structure red-shifts with increasing well width, and the peak position can be tuned by adjusting the width of the MQW shell. The GaAs/GaInAs core-MQW shell NW surrounded by AlGaAs also shows an enhanced PL intensity due to the improved carrier confinement owing to the presence of an AlGaAs clad layer. The inclined growth of the GaAs NWs produces a core-MQW shell structure having a different PL peak position than that of planar QWs. The PL emission by MQW shell and the ability to tune the PL peak position by varying the shell width make such core-shell NWs highly attractive for realizing next generation ultrasmall light sources and other optoelectronics devices. PACS: 81.07.Gf; 81.15.Hi; 78.55.Cr.