Magnetic composite fluid optimization for KDP crystal polishing based on a D-optimal mixture design.

The potassium dihydrogen phosphate (KDP) crystal is a kind of electro-optical nonlinear optical crystal with excellent performance, and has attracted much attention from researchers due to its wide application prospects. Some KDP processing techniques have been developed, but polishing KDP with a magnetic composite fluid (MCF) has not been reported, to our knowledge. Accordingly, first, taking the water solubility of KDP into account, a non-water-based MCF is developed based on previous research. Then, orthogonal experiments are used to determine optimal processing parameters of MCF. Finally, a D-optimal mixture design is used to establish a mathematical model of the influence of each component factor on surface roughness, and the ratio of key components in MCF is optimized. The results show that the theoretical optimum ratio is 20 wt.% base liquid (lauryl alcohol and Triton X-100), 39.962 wt.% carbonyl iron particles, and 25.038 wt.% F e 3 O 4. The KDP surface roughness (Ra) after 60 min of polishing converges to 7.5 nm, consistent with expected estimates, indicating that the formulation optimized by this method is effective and reliable.

Characteristic of fixed abrasive polishing for KDP in an anhydrous environment.

High grade optical components are rapidly being employed in a wide range of applications due to their great performance. Among these, KDP (potassium dihydrogen phosphate) is the preferred choice for frequency doubling components because to its large non-linear optical technique and high laser damage threshold. In this research, KDP is treated employing fixed polishing in an anhydrous environment. Copper oxide is utilized as abrasive, and toner and phenolic resin are combined to form pellets for KDP polishing. Calculation of the temperature field on the surface of the workpiece based on the relationship of the movement. The ideal polishing parameters are also determined from the findings of the temperature field and the optimum process parameters are 5kPa pressure, 150rpm and 8mm eccentricity. A new material removal model is presented and based on this, a unique processing technique to increase the material removal depth is provided. Interestingly, with this form of polishing, the surface roughness of the workpiece remains about Ra 20nm after a quick shift and does not alter with re-pressing.