Microelectronic current-sourcing device based on band-to-band tunneling current.

A new stable current-sourcing transistor is developed using the band-to-band tunneling phenomenon. A heterojunction between thin film WS2and heavily hole-doped bulk silicon converts a section of the WS2contacting the silicon into a hole-doped WS2inside the WS2channel, and band-to-band tunneling occurs between the electron-doped and hole-doped WS2. The output current is regulated by the tunneling barrier thickness. The thickness depends on the gate bias for device switching, but is less sensitive to the source bias, enabling stable output currents. The minimum line sensitivity is 2.6%, and the temperature coefficient is 1.4 × 103ppm°C-1. The device can be operated as a current sourcing device with an ultralow output current and power consumption.

PN junction and band to band tunneling in carbon nanotube transistors at room temperature.

We demonstrate band to band tunneling (BTBT) in a carbon nanotube (CNT) field effect transistor. We employ local electrostatic doping assisted by charged traps within the oxide to produce an intramolecular PN junction along the CNT. These characteristics apply for both metallic (m-CNTs) and semiconducting (SC-CNTs) CNTs. For m-CNTs we present a hysteretic transfer characteristic which originates from local electrostatic doping in the middle segment of the CNT. This controlled doping is reversible and results in formation and destruction of a PN junction along the CNT channel. For SC-CNTs we observe BTBT, and analysis based on the WKB approximation reveals a very narrow depletion region and high transmission probability at the optimal energy bands overlap. These results may assist in developing a non-volatile one-dimensional PN junction memory cell and designing a tunneling based field effect transistor.

A T-shaped gate tunneling field effect transistor with negative capacitance, super-steep subthreshold swing.

With the development of semiconductor technology, the size of traditional metal oxide semiconductor field effect transistor devices continues to decrease, but it cannot meet the requirements of high performance and low power consumption. Low power tunneling field effect transistor (TFET) has gradually become the focus of researchers. This paper proposes a novel T-shaped gate TFET based on the silicon with the negative capacitance (NC-TGTFET). On the basis of TGTFET, ferroelectric material (HZO) is used as gate dielectric. The simulation results show that, compared with the traditional TGTFET, the opening order and sensitivity of the two tunneling junctions are different. The influences of thickness and the doping concentration of pocket and ferroelectric material properties on the characteristics of NC-TGTFET is also discussed by Sentaurus simulation tool. Furthermore, the negative capacitance of ferroelectric material makes NC-TGTFET have a very steep subthreshold swing (18.32 mV/dec) at the range of drain current from 1 × 10-15to 1 × 10-7Aµm-1. And the on-state current (Vg= 0.5 V,Vd= 0.5 V) is 1.52 × 10-6Aµm-1.

Tunneling Spectroscopy in Carbon Nanotube-Hexagonal Boron Nitride-Carbon Nanotube Heterojunctions.

Electron tunneling spectroscopy is a powerful technique to probe the unique physical properties of one-dimensional (1D) single-walled carbon nanotubes (SWNTs), such as the van Hove singularities in the density of states or the power-law tunneling probability of a Luttinger liquid. However, little is known about the tunneling behavior between two 1D SWNTs over a large energy spectrum. Here, we investigate the electron tunneling behavior between two crossed SWNTs across a wide spectral window up to 2 eV in the unique carbon nanotube-hexagonal boron nitride-carbon nanotube heterojunctions. We observe many sharp resonances in the differential tunneling conductance at different bias voltages applied between the SWNTs. These resonances can be attributed to elastic tunneling into the van Hove singularities of different 1D subbands in both SWNTs, and they allow us to determine the quasi-particle bandgaps and higher-lying 1D subbands in SWNTs on the insulating substrate.

Transport Properties of a MoS2/WSe2 Heterojunction Transistor and Its Potential for Application.

This paper studies band-to-band tunneling in the transverse and lateral directions of van der Waals MoS2/WSe2 heterojunctions. We observe room-temperature negative differential resistance (NDR) in a heterojunction diode comprised of few-layer WSe2 stacked on multilayer MoS2. The presence of NDR is attributed to the lateral band-to-band tunneling at the edge of the MoS2/WSe2 heterojunction. The backward tunneling diode shows an average conductance slope of 75 mV/dec with a high curvature coefficient of 62 V(-1). Associated with the tunnel-diode characteristics, a positive-to-negative transconductance in the MoS2/WSe2 heterojunction transistors is observed. The transition is induced by strong interlayer coupling between the films, which results in charge density and energy-band modulation. The sign change in transconductance is particularly useful for multivalued logic (MVL) circuits, and we therefore propose and demonstrate for the first time an MVL-inverter that shows three levels of logic using one pair of p-type transistors.

Atomic-Monolayer MoS2 Band-to-Band Tunneling Field-Effect Transistor.

The experimental observation of band-to-band tunneling in novel tunneling field-effect transistors utilizing a monolayer of MoS2 as the conducting channel is demonstrated. Our results indicate that the strong gate-coupling efficiency enabled by two-dimensional materials, such as monolayer MoS2 , results in the direct manifestation of a band-to-band tunneling current and an ambipolar transport.

Multimode silicon nanowire transistors.

The combined capabilities of both a nonplanar design and nonconventional carrier injection mechanisms are subject to recent scientific investigations to overcome the limitations of silicon metal oxide semiconductor field effect transistors. In this Letter, we present a multimode field effect transistors device using silicon nanowires that feature an axial n-type/intrinsic doping junction. A heterostructural device design is achieved by employing a self-aligned nickel-silicide source contact. The polymorph operation of the dual-gate device enabling the configuration of one p- and two n-type transistor modes is demonstrated. Not only the type but also the carrier injection mode can be altered by appropriate biasing of the two gate terminals or by inverting the drain bias. With a combined band-to-band and Schottky tunneling mechanism, in p-type mode a subthreshold swing as low as 143 mV/dec and an ON/OFF ratio of up to 10(4) is found. As the device operates in forward bias, a nonconventional tunneling transistor is realized, enabling an effective suppression of ambipolarity. Depending on the drain bias, two different n-type modes are distinguishable. The carrier injection is dominated by thermionic emission in forward bias with a maximum ON/OFF ratio of up to 10(7) whereas in reverse bias a Schottky tunneling mechanism dominates the carrier transport.

Single-Gate MoS2 Tunnel FET with a Thickness-Modulated Homojunction.

Two-dimensional (2D) materials stand as a promising platform for tunnel field-effect transistors (TFETs) in the pursuit of low-power electronics for the Internet of Things era. This promise arises from their dangling bond-free van der Waals heterointerface. Nevertheless, the attainment of high device performance is markedly impeded by the requirement of precise control over the 2D assembly with multiple stacks of different layers. In this study, we addressed a thickness-modulated n/p+-homojunction prepared from Nb-doped p+-MoS2 crystal, where the issue on interface traps can be neglected without any external interface control due to the homojunction. Notably, our observations reveal the existence of a negative differential resistance, even at room temperature (RT). This signifies the successful realization of TFET operation under type III band alignment conditions by a single gate at RT, suggesting that the dominant current mechanism is band-to-band tunneling due to the ideal interface.

Leakage and Thermal Reliability Optimization of Stacked Nanosheet Field-Effect Transistors with SiC Layers.

In this work, we propose a SiC-NSFET structure that uses a PTS scheme only under the gate, with SiC layers under the source and drain, to improve the leakage current and thermal reliability. Punch-through stopper (PTS) doping is widely used to suppress the leakage current, but aggressively high PTS doping will cause additional band-to-band (BTBT) current. Therefore, the bottom oxide isolation nanosheet field-effect transistor (BOX-NSFET) can further reduce the leakage current and become an alternative to conventional structures with PTS. However, thermal reliability issues, like bias temperature instability (BTI), hot carrier injection (HCI), and time-dependent dielectric breakdown (TDDB), induced by the self-heating effect (SHE) of BOX-NSFET, become more profound due to the lower thermal conductivity of SiO2 than silicon. Moreover, the bottom oxide will reduce the stress along the channel due to the challenges associated with growing high-quality SiGe material on SiO2. Therefore, this method faces difficulties in enhancing the mobility of p-type devices. The comprehensive TCAD simulation results show that SiC-NSFET significantly suppresses the substrate leakage current compared to the conventional structure with PTS. In addition, compared to the BOX-NSFET, the stress reduction caused by the bottom oxide is avoided, and the SHE is mitigated. This work provides significant design guidelines for leakage and thermal reliability optimization of next-generation advanced nodes.

Electrostatically Doped Junctionless Graphene Nanoribbon Tunnel Field-Effect Transistor for High-Performance Gas Sensing Applications: Leveraging Doping Gates for Multi-Gas Detection.

In this paper, a new junctionless graphene nanoribbon tunnel field-effect transistor (JLGNR TFET) is proposed as a multi-gas nanosensor. The nanosensor has been computationally assessed using a quantum simulation based on the self-consistent solutions of the mode space non-equilibrium Green's function (NEGF) formalism coupled with the Poisson's equation considering ballistic transport conditions. The proposed multi-gas nanosensor is endowed with two top gates ensuring both reservoirs' doping and multi-gas sensing. The investigations have included the IDS-VGS transfer characteristics, the gas-induced electrostatic modulations, subthreshold swing, and sensitivity. The order of change in drain current has been considered as a sensitivity metric. The underlying physics of the proposed JLGNR TFET-based multi-gas nanosensor has also been studied through the analysis of the band diagrams behavior and the energy-position-resolved current spectrum. It has been found that the gas-induced work function modulation of the source (drain) gate affects the n-type (p-type) conduction branch by modulating the band-to-band tunneling (BTBT) while the p-type (n-type) conduction branch still unaffected forming a kind of high selectivity from operating regime point of view. The high sensitivity has been recorded in subthermionic subthreshold swing (SS < 60 mV/dec) regime considering small gas-induced gate work function modulation. In addition, advanced simulations have been performed for the detection of two different types of gases separately and simultaneously, where high-performance has been recorded in terms of sensitivity, selectivity, and electrical behavior. The proposed detection approach, which is viable, innovative, simple, and efficient, can be applied using other types of junctionless tunneling field-effect transistors with emerging channel nanomaterials such as the transition metal dichalcogenides materials. The proposed JLGNRTFET-based multi-gas nanosensor is not limited to two specific gases but can also detect other gases by employing appropriate gate materials in terms of selectivity.

Assessment of the Biosensing Capabilities of SiGe Heterojunction Negative Capacitance-Vertical Tunnel Field-Effect Transistor.

In this study, a comparison of the negative capacitance vertical tunnel field-effect transistor (NC-VTFET) and VTFET for biosensing applications was conducted. Dielectrically modulated TFET demonstrates better sensitivity than the traditional metal oxide field effect transistor as a biosensor in label-free biosensing applications. The TFET biosensor, however, has much room for advancement by enhancing its DC characteristics. This research addresses the impact of ferroelectric gate oxide for integration of negative capacitance (NC) effect with the SiGe heterojunction pocket at the source-channel junction to enhance performance for biosensor applications. By putting the NC layer over SiO2, the channel voltage increases with decreased subthreshold slope and OFF current, thereby creating an NC effect. Because SiGe has a narrow band gap, pocket doping of SiGe near the source channel junction will increase the concentration of charge carriers, improving the band-to-band tunneling. In order to aid in the integration of biomolecules and to modulate band-to-band tunneling based on charge density (qf), dielectric constant (k), temperature, and cavity length, a cavity is additionally inserted above the source channel junction and underneath the NC layer, near to SiO2. These values were compared with and without the incorporation of NC layer with respect to various electrical properties such as drain current (Id), sensitivity, and electric field (E). According to the findings, labeled and label-free biosensors' sensitivity may be increased by incorporating the NC effect into VTFET biosensors.

Nanosheet integration of induced tunnel field-effect transistor with lower cost and lower power.

Nanosheet transistors are poised to become the preferred choice for the next generation of smaller-sized devices in the future. To address the future demand for high-performance and low-power computing applications, this study proposes a nanosheet structure with a vertically stacked design, featuring a high ION/IOFF ratio. This Nanosheet design is combined with an induced tunnel field-effect transistor. By utilizing SiGe with a carrier mobility three times that of Si and employing a line tunneling mechanism, the research successfully achieves superior Band to Band characteristics, resulting in improved switching behavior and a lower Subthreshold Swing (SS). Comparative studies were conducted on three TFET types: Nanosheet PIN TFET, Nanosheet Schottky iTFET, and Fin iTFET. Results show that the Nanosheet PIN TFET has a higher ION/IOFF ratio but poorer SSavg values at 47.63 mV/dec compared to the others. However, with a SiGe Body thickness of 3 nm, both Nanosheet iTFET and Fin iTFET exhibit higher ION/IOFF ratios and superior SSavg values at 17.64 mV/dec. These findings suggest the potential of Nanosheet iTFET and Fin iTFET for low-power, lower thermal budgets, and fast-switching applications.

Novel SiGe/Si Heterojunction Double-Gate Tunneling FETs with a Heterogate Dielectric for High Performance.

In this paper, a new SiGe/Si heterojunction double-gate heterogate dielectric tunneling field-effect transistor with an auxiliary tunneling barrier layer (HJ-HD-P-DGTFET) is proposed and investigated using TCAD tools. SiGe material has a smaller band gap than Si, so a heterojunction with SiGe(source)/Si(channel) can result in a smaller tunneling distance, which is very helpful in boosting the tunneling rate. The gate dielectric near the drain region consists of low-k SiO2 to weaken the gate control of the channel-drain tunneling junction and reduce the ambipolar current (Iamb). In contrast, the gate dielectric near the source region consists of high-k HfO2 to increase the on-state current (Ion) through the method of gate control. To further increase Ion, an n+-doped auxiliary tunneling barrier layer (pocket)is used to reduce the tunneling distance. Therefore, the proposed HJ-HD-P-DGTFET can obtain a higher on-state current and suppressed ambipolar effect. The simulation results show that a large Ion of 7.79 × 10-5 A/µm, a suppressed Ioff of 8.16 × 10-18 A/µm, minimum subthreshold swing (SSmin) of 19 mV/dec, a cutoff frequency (fT) of 19.95 GHz, and gain bandwidth product (GBW) of 2.07 GHz can be achieved. The data indicate that HJ-HD-P-DGTFET is a promising device for low-power-consumption radio frequency applications.

Band-to-Band Tunneling Leakage Current Characterization and Projection in Carbon Nanotube Transistors.

Carbon nanotube (CNT) transistors demonstrate high mobility but also experience off-state leakage due to the small effective mass and band gap. The lower limit of off-current (IMIN) was measured in electrostatically doped CNT metal-oxide-semiconductor field-effect transistors (MOSFETs) across a range of band gaps (0.37 to 1.19 eV), supply voltages (0.5 to 0.7 V), and extension doping levels (0.2 to 0.8 carriers/nm). A nonequilibrium Green's function (NEGF) model confirms the dependence of IMIN on CNT band gap, supply voltage, and extension doping level. A leakage current design space across CNT band gap, supply voltage, and extension doping is projected based on the validated NEGF model for long-channel CNT MOSFETs to identify the appropriate device design choices. The optimal extension doping and CNT band gap design choice for a target off-current density are identified by including on-current projection in the leakage current design space. An extension doping level >0.5 carrier/nm is required for optimized on-current.

A new line tunneling SiGe/Si iTFET with control gate for leakage suppression and subthreshold swing improvement.

This article presents a new line tunneling dominating metal-semiconductor contact-induced SiGe-Si tunnel field-effect transistor with control gate (CG-Line SiGe/Si iTFET). With a structure where two symmetrical control gates at the drain region are given a sufficient negative bias, the overlap of the energy bands at the drain in the OFF-state is effectively suppressed, thus reducing the tunneling probability and significantly decreasing leakage current. Additionally, the large overlap area between the source and gate improves the gate's ability to control the tunneling interface effectively, improving the ON-state current and subthreshold swing characteristics. By using the Schottky contact characteristics of a metal-semiconductor contact with different work functions to form a PN junction, the need to control doping profiles or random doping fluctuations is avoided. Furthermore, as ion implantation is not required, issues related to subsequent annealing are also eliminated, greatly reducing thermal budget. Due to the different material bandgap characteristics selected for the source and drain regions, the probability of overlap of the energy bands in the source region in the ON-state is increased and that in the drain region in the OFF-state is reduced. Based on the feasibility of the actual fabrication process and through rigorous 2D simulation studies, improvements in subthreshold swing and high on/off current ratio can be achieved simultaneously based on the proposed device structure. Additionally, the presence of the control gate structure effectively suppresses leakage current, further enhancing its potential for low-power-consumption applications.

Multilayer In-Plane Heterostructures Based on Transition Metal Dichalcogenides for Advanced Electronics.

In-plane heterostructures of transition metal dichalcogenides (TMDCs) have attracted much attention for high-performance electronic and optoelectronic devices. To date, mainly monolayer-based in-plane heterostructures have been prepared by chemical vapor deposition (CVD), and their optical and electrical properties have been investigated. However, the low dielectric properties of monolayers prevent the generation of high concentrations of thermally excited carriers from doped impurities. To solve this issue, multilayer TMDCs are a promising component for various electronic devices due to the availability of degenerate semiconductors. Here, we report the fabrication and transport properties of multilayer TMDC-based in-plane heterostructures. The multilayer in-plane heterostructures are formed through CVD growth of multilayer MoS2 from the edges of mechanically exfoliated multilayer flakes of WSe2 or NbxMo1-xS2. In addition to the in-plane heterostructures, we also confirmed the vertical growth of MoS2 on the exfoliated flakes. For the WSe2/MoS2 sample, an abrupt composition change is confirmed by cross-sectional high-angle annular dark-field scanning transmission electron microscopy. Electrical transport measurements reveal that a tunneling current flows at the NbxMo1-xS2/MoS2 in-plane heterointerface, and the band alignment is changed from a staggered gap to a broken gap by electrostatic electron doping of MoS2. The formation of a staggered gap band alignment of NbxMo1-xS2/MoS2 is also supported by first-principles calculations.

Single-Particle Irradiation Effect and Anti-Irradiation Optimization of a JLTFET with Lightly Doped Source.

In this article, the particle irradiation effect of a lightly doped Gaussian source heterostructure junctionless tunnel field-effect transistor (DMG-GDS-HJLTFET) is discussed. In the irradiation phenomenon, heavy ion produces a series of electron-hole pairs along the incident track, and then the generated transient current can overturn the logical state of the device when the number of electron-hole pairs is large enough. In the single-particle effect of DMG-GDS-HJLTFET, the carried energy is usually represented by linear energy transfer value (LET). In simulation, the effects of incident ion energy, incident angle, incident completion time, incident position and drain bias voltage on the single-particle effect of DMG-GDS-HJLTFET are investigated. On this basis, we optimize the auxiliary gate dielectric, tunneling gate length for reliability. Simulation results show HfO2 with a large dielectric constant should be selected as the auxiliary gate dielectric in the anti-irradiation design. Larger tunneling gate leads to larger peak transient drain current and smaller tunneling gate means larger pulse width; from the point of anti-irradiation, the tunneling gate length should be selected at about 10 nm.

Electrically Doped PNPN Tunnel Field-Effect Transistor Using Dual-Material Polarity Gate with Improved DC and Analog/RF Performance.

A new structure for PNPN tunnel field-effect transistors (TFETs) has been designed and simulated in this work. The proposed structure incorporates the polarity bias concept and the gate work function engineering to improve the DC and analog/RF figures of merit. The proposed device consists of a control gate (CG) and a polarity gate (PG), where the PG uses a dual-material gate (DMG) structure and is biased at -0.7 V to induce a P+ region in the source. The PNPN structure introduces a local minimum on the conduction band edge curve at the tunneling junction, which dramatically reduces the tunneling width. Furthermore, we show that incorporating the DMG architecture further enhances the drive current and improves the subthreshold slope (SS) characteristics by introducing an additional electric field peak. The numerical simulation reveals that the electrically doped PNPN TFET using DMG improves the DC and analog/RF performances in comparison to a conventional single-material gate (SMG) device.

Performance Assessment of a Junctionless Heterostructure Tunnel FET Biosensor Using Dual Material Gate.

Biosensors based on tunnel FET for label-free detection in which a nanogap is introduced under gate electrode to electrically sense the characteristics of biomolecules, have been studied widely in recent years. In this paper, a new type of heterostructure junctionless tunnel FET biosensor with an embedded nanogap is proposed, in which the control gate consists of two parts, namely the tunnel gate and auxiliary gate, with different work functions; and the detection sensitivity of different biomolecules can be controlled and adjusted by the two gates. Further, a polar gate is introduced above the source region, and a P+ source is formed by the charge plasma concept by selecting appropriate work functions for the polar gate. The variation of sensitivity with different control gate and polar gate work functions is explored. Neutral and charged biomolecules are considered to simulate device-level gate effects, and the influence of different dielectric constants on sensitivity is also researched. The simulation results show that the switch ratio of the proposed biosensor can reach 109, the maximum current sensitivity is 6.91 × 102, and the maximum sensitivity of the average subthreshold swing (SS) is 0.62.

A Novel L-Gate InGaAs/GaAsSb TFET with Improved Performance and Suppressed Ambipolar Effect.

A heterojunction tunneling field effect transistor with an L-shaped gate (HJ-LTFET), which is very applicable to operate at low voltage, is proposed and studied by TCAD tools in this paper. InGaAs/GaAsSb heterojunction is applied in HJ-LTFET to enhance the ON-state current (ION). Owing to the quasi-broken gap energy band alignment of InGaAs/GaAsSb heterojunction, height and thickness of tunneling barrier are greatly reduced. However, the OFF-state leakage current (IOFF) also increases significantly due to the reduced barrier height and thickness and results in an obvious source-to-drain tunneling (SDT). In order to solve this problem, an HfO2 barrier layer is inserted between source and drain. Result shows that the insertion layer can greatly suppress the horizontal tunneling leakage appears at the source and drain interface. Other optimization studies such as work function modulation, doping concentration optimization, scaling capability, and analog/RF performance analysis are carried out, too. Finally, the HJ-LTFET with a large ION of 213 µA/µm, a steep average SS of 8.9 mV/dec, and a suppressed IOFF of 10-12 µA/µm can be obtained. Not only that, but the fT and GBP reached the maximum values of 68.3 GHz and 7.3 GHz under the condition of Vd = 0.5 V, respectively.