C2H4 adsorption on Cu(210), revisited: bonding nature and coverage effects.

Amino, Shuichi; Arguelles, Elvis; Agerico Diño, Wilson; Okada, Michio; Kasai, Hideaki

Amino, Shuichi; Arguelles, Elvis; Agerico Diño, Wilson; Okada, Michio; Kasai, Hideaki.

Afiliação

Amino S; Department of Applied Physics, Osaka University, Suita, Osaka 565-0871, Japan.
Arguelles E; Department of Applied Physics, Osaka University, Suita, Osaka 565-0871, Japan.
Agerico Diño W; Department of Applied Physics, Osaka University, Suita, Osaka 565-0871, Japan and Center for Atomic and Molecular Technologies, Osaka University, Suita, Osaka 565-0871, Japan. wilson@dyn.ap.eng.osaka-u.ac.jp and Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 567-0047, Japan
Okada M; Department of Chemistry, Graduate School of Science, Osaka University, Toyonaka, Osaka 560-0043, Japan.
Kasai H; National Institute of Technology, Akashi College, Akashi, Hyogo 674-8501, Japan and Institute of Industrial Science, The University of Tokyo, Komaba, Meguro, Tokyo 153-8501, Japan and Graduate School of Engineering, Osaka University, Suita, Osaka 565-0871, Japan.

Phys Chem Chem Phys ; 18(34): 23621-7, 2016 Aug 24.

Article em En | MEDLINE | ID: mdl-27506302

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2016 Tipo de documento: Article

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2016 Tipo de documento: Article