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Combination of Carrier Concentration Regulation and High Band Degeneracy for Enhanced Thermoelectric Performance of Cu3SbSe4.
Zhang, Dan; Yang, Junyou; Jiang, Qinghui; Zhou, Zhiwei; Li, Xin; Xin, Jiwu; Basit, Abdul; Ren, Yangyang; He, Xu; Chu, Weijing; Hou, Jingdi.
Afiliação
  • Zhang D; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
  • Yang J; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
  • Jiang Q; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
  • Zhou Z; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
  • Li X; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
  • Xin J; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
  • Basit A; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
  • Ren Y; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
  • He X; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
  • Chu W; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
  • Hou J; State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology , Wuhan 430074, P.R. China.
ACS Appl Mater Interfaces ; 9(34): 28558-28565, 2017 Aug 30.
Article em En | MEDLINE | ID: mdl-28792200
ABSTRACT
The effect of Al-, Ga-, and In-doping on the thermoelectric (TE) properties of Cu3SbSe4 has been comparatively studied on the basis of theoretical prediction and experimental validation. It is found that tiny Al/Ga/In substitution leads to a great enhancement of electrical conductivity with high carrier concentration and also large Seebeck coefficient due to the preserved high band degeneracy and thereby a remarkably high power factor. Ultimately, coupled with the depressed lattice thermal conductivity, all three elements (Al/Ga/In) substituted samples have obtained a highly improved thermoelectric performance with respect to undoped Cu3SbSe4. Compared to the samples at the same Al/In doping level, the slightly Ga-doped sample presents better TE performance over the wide temperature range, and the Cu3Sb0.995Ga0.005Se4 sample presents a record high ZT value of 0.9 among single-doped Cu3SbSe4 at 623 K, which is about 80% higher than that of pristine Cu3SbSe4. This work offers an alternative approach to boost the TE properties of Cu3SbSe4 by selecting efficient dopant to weaken the coupling between electrical conductivity and Seebeck coefficient.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Tipo de estudo: Prognostic_studies Idioma: En Ano de publicação: 2017 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Tipo de estudo: Prognostic_studies Idioma: En Ano de publicação: 2017 Tipo de documento: Article