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Three-dimensional mesostructures as high-temperature growth templates, electronic cellular scaffolds, and self-propelled microrobots.
Yan, Zheng; Han, Mengdi; Shi, Yan; Badea, Adina; Yang, Yiyuan; Kulkarni, Ashish; Hanson, Erik; Kandel, Mikhail E; Wen, Xiewen; Zhang, Fan; Luo, Yiyue; Lin, Qing; Zhang, Hang; Guo, Xiaogang; Huang, Yuming; Nan, Kewang; Jia, Shuai; Oraham, Aaron W; Mevis, Molly B; Lim, Jaeman; Guo, Xuelin; Gao, Mingye; Ryu, Woomi; Yu, Ki Jun; Nicolau, Bruno G; Petronico, Aaron; Rubakhin, Stanislav S; Lou, Jun; Ajayan, Pulickel M; Thornton, Katsuyo; Popescu, Gabriel; Fang, Daining; Sweedler, Jonathan V; Braun, Paul V; Zhang, Haixia; Nuzzo, Ralph G; Huang, Yonggang; Zhang, Yihui; Rogers, John A.
Afiliação
  • Yan Z; Department of Chemical Engineering, University of Missouri, Columbia, MO 65211.
  • Han M; Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO 65211.
  • Shi Y; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Badea A; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Yang Y; National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing 100871, People's Republic of China.
  • Kulkarni A; Center for Mechanics and Materials, Tsinghua University, Beijing 100084, People's Republic of China.
  • Hanson E; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People's Republic of China.
  • Kandel ME; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People's Republic of China.
  • Wen X; State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, People's Republic of China.
  • Zhang F; School of Chemical Sciences, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Luo Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208.
  • Lin Q; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Zhang H; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Guo X; Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109.
  • Huang Y; Beckman Institute of Advanced Science and Technology, Quantitative Light Imaging Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Nan K; Department of Materials Science and NanoEngineering, Rice University, Houston, TX 77005.
  • Jia S; Center for Mechanics and Materials, Tsinghua University, Beijing 100084, People's Republic of China.
  • Oraham AW; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People's Republic of China.
  • Mevis MB; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People's Republic of China.
  • Lim J; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Guo X; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Gao M; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Ryu W; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Yu KJ; Center for Mechanics and Materials, Tsinghua University, Beijing 100084, People's Republic of China.
  • Nicolau BG; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People's Republic of China.
  • Petronico A; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People's Republic of China.
  • Rubakhin SS; Center for Mechanics and Materials, Tsinghua University, Beijing 100084, People's Republic of China.
  • Lou J; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People's Republic of China.
  • Ajayan PM; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People's Republic of China.
  • Thornton K; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Popescu G; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Fang D; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Sweedler JV; Department of Materials Science and NanoEngineering, Rice University, Houston, TX 77005.
  • Braun PV; School of Chemical Sciences, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Zhang H; School of Chemical Sciences, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Nuzzo RG; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Huang Y; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Zhang Y; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Rogers JA; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
Proc Natl Acad Sci U S A ; 114(45): E9455-E9464, 2017 11 07.
Article em En | MEDLINE | ID: mdl-29078394
ABSTRACT
Recent work demonstrates that processes of stress release in prestrained elastomeric substrates can guide the assembly of sophisticated 3D micro/nanostructures in advanced materials. Reported application examples include soft electronic components, tunable electromagnetic and optical devices, vibrational metrology platforms, and other unusual technologies, each enabled by uniquely engineered 3D architectures. A significant disadvantage of these systems is that the elastomeric substrates, while essential to the assembly process, can impose significant engineering constraints in terms of operating temperatures and levels of dimensional stability; they also prevent the realization of 3D structures in freestanding forms. Here, we introduce concepts in interfacial photopolymerization, nonlinear mechanics, and physical transfer that bypass these limitations. The results enable 3D mesostructures in fully or partially freestanding forms, with additional capabilities in integration onto nearly any class of substrate, from planar, hard inorganic materials to textured, soft biological tissues, all via mechanisms quantitatively described by theoretical modeling. Illustrations of these ideas include their use in 3D structures as frameworks for templated growth of organized lamellae from AgCl-KCl eutectics and of atomic layers of WSe2 from vapor-phase precursors, as open-architecture electronic scaffolds for formation of dorsal root ganglion (DRG) neural networks, and as catalyst supports for propulsive systems in 3D microswimmers with geometrically controlled dynamics. Taken together, these methodologies establish a set of enabling options in 3D micro/nanomanufacturing that lie outside of the scope of existing alternatives.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Nanoestruturas / Alicerces Teciduais Limite: Animals Idioma: En Ano de publicação: 2017 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Nanoestruturas / Alicerces Teciduais Limite: Animals Idioma: En Ano de publicação: 2017 Tipo de documento: Article