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Atomically flat and uniform relaxed III-V epitaxial films on silicon substrate for heterogeneous and hybrid integration.
Holland, Martin; van Dal, Mark; Duriez, Blandine; Oxland, Richard; Vellianitis, Georgios; Doornbos, Gerben; Afzalian, Aryan; Chen, Ta-Kun; Hsieh, Chih-Hua; Ramvall, Peter; Vasen, Tim; Yeo, Yee-Chia; Passlack, Matthias.
Afiliação
  • Holland M; TSMC R&D Europe B.V., Kapeldreef 75, 3001, Leuven, Belgium.
  • van Dal M; TSMC R&D Europe B.V., Kapeldreef 75, 3001, Leuven, Belgium.
  • Duriez B; TSMC R&D Europe B.V., Kapeldreef 75, 3001, Leuven, Belgium.
  • Oxland R; TSMC R&D Europe B.V., Kapeldreef 75, 3001, Leuven, Belgium.
  • Vellianitis G; TSMC R&D Europe B.V., Kapeldreef 75, 3001, Leuven, Belgium.
  • Doornbos G; TSMC R&D Europe B.V., Kapeldreef 75, 3001, Leuven, Belgium.
  • Afzalian A; TSMC R&D Europe B.V., Kapeldreef 75, 3001, Leuven, Belgium.
  • Chen TK; TSMC, No. 8. Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, 300-78, Taiwan, R.O.C.
  • Hsieh CH; TSMC, No. 8. Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, 300-78, Taiwan, R.O.C.
  • Ramvall P; TSMC R&D Europe B.V., Kapeldreef 75, 3001, Leuven, Belgium.
  • Vasen T; TSMC R&D Europe B.V., Kapeldreef 75, 3001, Leuven, Belgium.
  • Yeo YC; TSMC, No. 8. Li-Hsin Rd. VI, Hsinchu Science Park, Hsinchu, 300-78, Taiwan, R.O.C.
  • Passlack M; TSMC R&D Europe B.V., Kapeldreef 75, 3001, Leuven, Belgium. matthias_passlack@tsmc.com.
Sci Rep ; 7(1): 14632, 2017 11 07.
Article em En | MEDLINE | ID: mdl-29116157
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2017 Tipo de documento: Article
Texto completo
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XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2017 Tipo de documento: Article