Experiments on Temperature Changes of Microbolometer under Blackbody Radiation and Predictions Using Thermal Modeling by COMSOL Multiphysics Simulator.

Deng, Yu-Zhen; Tang, Shiang-Feng; Zeng, Hong-Yuan; Wu, Zheng-Yuan; Tung, Der-Kuo

Deng, Yu-Zhen; Tang, Shiang-Feng; Zeng, Hong-Yuan; Wu, Zheng-Yuan; Tung, Der-Kuo.

Afiliação

Deng YZ; Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan 33000, Taiwan. jcoh185@gmail.com.
Tang SF; Materials & Electro-Optics Research Division, National Chung Shan Institute of Science and Technology, Taoyuan 32599, Taiwan. shiangfengtang@gmail.com.
Zeng HY; Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan 33000, Taiwan. gto1244@gmail.com.
Wu ZY; Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan 33000, Taiwan. shelter19811110@gmail.com.
Tung DK; Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan 33000, Taiwan. dktung@ndu.edu.tw.

Sensors (Basel) ; 18(8)2018 Aug 08.

Article em En | MEDLINE | ID: mdl-30096759

Palavras-chave

COMSOL Multiphysics; blackbody; heat transfer model; microbolometer; temperature coefficient of resistance (TCR); thermal conductance; thermal equivalent resistance differences (TERD)

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Tipo de estudo: Prognostic_studies / Risk_factors_studies Idioma: En Ano de publicação: 2018 Tipo de documento: Article

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