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Application Challenges in Fiber and Textile Electronics.
Wang, Lie; Fu, Xuemei; He, Jiqing; Shi, Xiang; Chen, Taiqiang; Chen, Peining; Wang, Bingjie; Peng, Huisheng.
Afiliação
  • Wang L; Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438, China.
  • Fu X; Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438, China.
  • He J; Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438, China.
  • Shi X; Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438, China.
  • Chen T; Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438, China.
  • Chen P; Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438, China.
  • Wang B; Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438, China.
  • Peng H; Laboratory of Advanced Materials, State Key Laboratory of Molecular Engineering of Polymers and Department of Macromolecular Science, Fudan University, 2205 Songhu Road, Shanghai, 200438, China.
Adv Mater ; 32(5): e1901971, 2020 Feb.
Article em En | MEDLINE | ID: mdl-31273843
ABSTRACT
Modern electronic devices are moving toward miniaturization and integration with an emerging focus on wearable electronics. Due to their close contact with the human body, wearable electronics have new requirements including low weight, small size, and flexibility. Conventional 3D and 2D electronic devices fail to efficiently meet these requirements due to their rigidity and bulkiness. Hence, a new family of 1D fiber-shaped electronic devices including energy-harvesting devices, energy-storage devices, light-emitting devices, and sensing devices has risen to the challenge due to their small diameter, lightweight, flexibility, and weavability into soft textile electronics. The application challenges faced by fiber and textile electronics from single fiber-shaped devices to continuously scalable fabrication, to encapsulation and testing, and to application mode exploration, are discussed. The evolutionary trends of fiber and textile electronics are then summarized. Finally, future directions required to boost their commercialization are highlighted.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2020 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2020 Tipo de documento: Article