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Flexible electronic/optoelectronic microsystems with scalable designs for chronic biointegration.
Song, Enming; Chiang, Chia-Han; Li, Rui; Jin, Xin; Zhao, Jianing; Hill, Mackenna; Xia, Yu; Li, Lizhu; Huang, Yuming; Won, Sang Min; Yu, Ki Jun; Sheng, Xing; Fang, Hui; Alam, Muhammad Ashraful; Huang, Yonggang; Viventi, Jonathan; Chang, Jan-Kai; Rogers, John A.
Afiliação
  • Song E; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208.
  • Chiang CH; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Li R; Department of Biomedical Engineering, Duke University, Durham, NC 27708.
  • Jin X; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, 116024 Dalian, China.
  • Zhao J; International Research Center for Computational Mechanics, Dalian University of Technology, 116024 Dalian, China.
  • Hill M; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907.
  • Xia Y; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Li L; Department of Biomedical Engineering, Duke University, Durham, NC 27708.
  • Huang Y; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Won SM; Department of Electronic Engineering, Tsinghua University, 100084 Beijing, China.
  • Yu KJ; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Sheng X; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  • Fang H; School of Electrical and Electronic Engineering, Yonsei University, 03722 Seoul, Republic of Korea.
  • Alam MA; Department of Electronic Engineering, Tsinghua University, 100084 Beijing, China.
  • Huang Y; Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115.
  • Viventi J; School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907.
  • Chang JK; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208.
  • Rogers JA; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208.
Proc Natl Acad Sci U S A ; 116(31): 15398-15406, 2019 07 30.
Article em En | MEDLINE | ID: mdl-31308234
ABSTRACT
Flexible biocompatible electronic systems that leverage key materials and manufacturing techniques associated with the consumer electronics industry have potential for broad applications in biomedicine and biological research. This study reports scalable approaches to technologies of this type, where thin microscale device components integrate onto flexible polymer substrates in interconnected arrays to provide multimodal, high performance operational capabilities as intimately coupled biointerfaces. Specificially, the material options and engineering schemes summarized here serve as foundations for diverse, heterogeneously integrated systems. Scaled examples incorporate >32,000 silicon microdie and inorganic microscale light-emitting diodes derived from wafer sources distributed at variable pitch spacings and fill factors across large areas on polymer films, at full organ-scale dimensions such as human brain, over ∼150 cm2 In vitro studies and accelerated testing in simulated biofluids, together with theoretical simulations of underlying processes, yield quantitative insights into the key materials aspects. The results suggest an ability of these systems to operate in a biologically safe, stable fashion with projected lifetimes of several decades without leakage currents or reductions in performance. The versatility of these combined concepts suggests applicability to many classes of biointegrated semiconductor devices.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article