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Monolithic Integration of Silicon Nanowire Networks as a Soft Wafer for Highly Stretchable and Transparent Electronics.
Dong, Taige; Sun, Ying; Zhu, Zhimin; Wu, Xiaoxiang; Wang, Junzhuan; Shi, Yi; Xu, Jun; Chen, Kunji; Yu, Linwei.
Afiliação
  • Dong T; National Laboratory of Solid State Microstructures/School of Electronics Science and Engineering/Collaborative Innovation Center of Advanced Microstructures , Nanjing University , 210093 Nanjing , China.
  • Sun Y; National Laboratory of Solid State Microstructures/School of Electronics Science and Engineering/Collaborative Innovation Center of Advanced Microstructures , Nanjing University , 210093 Nanjing , China.
  • Zhu Z; National Laboratory of Solid State Microstructures/School of Electronics Science and Engineering/Collaborative Innovation Center of Advanced Microstructures , Nanjing University , 210093 Nanjing , China.
  • Wu X; National Laboratory of Solid State Microstructures/School of Electronics Science and Engineering/Collaborative Innovation Center of Advanced Microstructures , Nanjing University , 210093 Nanjing , China.
  • Wang J; National Laboratory of Solid State Microstructures/School of Electronics Science and Engineering/Collaborative Innovation Center of Advanced Microstructures , Nanjing University , 210093 Nanjing , China.
  • Shi Y; National Laboratory of Solid State Microstructures/School of Electronics Science and Engineering/Collaborative Innovation Center of Advanced Microstructures , Nanjing University , 210093 Nanjing , China.
  • Xu J; National Laboratory of Solid State Microstructures/School of Electronics Science and Engineering/Collaborative Innovation Center of Advanced Microstructures , Nanjing University , 210093 Nanjing , China.
  • Chen K; National Laboratory of Solid State Microstructures/School of Electronics Science and Engineering/Collaborative Innovation Center of Advanced Microstructures , Nanjing University , 210093 Nanjing , China.
  • Yu L; National Laboratory of Solid State Microstructures/School of Electronics Science and Engineering/Collaborative Innovation Center of Advanced Microstructures , Nanjing University , 210093 Nanjing , China.
Nano Lett ; 19(9): 6235-6243, 2019 Sep 11.
Article em En | MEDLINE | ID: mdl-31415178
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article
Texto completo
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article