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Ultimate suppression of thermal transport in amorphous silicon nitride by phononic nanostructure.
Tambo, Naoki; Liao, Yuxuan; Zhou, Chun; Ashley, Elizabeth Michiko; Takahashi, Kouhei; Nealey, Paul F; Naito, Yasuyuki; Shiomi, Junichiro.
Afiliação
  • Tambo N; Technology Division, Panasonic Corporation, Kyoto, Japan. tambo.naoki@jp.panasonic.com shiomi@photon.t.u-tokyo.ac.jp.
  • Liao Y; Department of Mechanical Engineering, The University of Tokyo, Tokyo, Japan.
  • Zhou C; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA.
  • Ashley EM; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA.
  • Takahashi K; Technology Division, Panasonic Corporation, Kyoto, Japan.
  • Nealey PF; Pritzker School of Molecular Engineering, University of Chicago, Chicago, IL, USA.
  • Naito Y; Materials Science Division, Argonne National Laboratory, Argonne, IL, USA.
  • Shiomi J; Technology Division, Panasonic Corporation, Kyoto, Japan.
Sci Adv ; 6(39)2020 Sep.
Article em En | MEDLINE | ID: mdl-32978150
ABSTRACT
Engineering the thermal conductivity of amorphous materials is highly essential for the thermal management of future electronic devices. Here, we demonstrate the impact of ultrafine nanostructuring on the thermal conductivity reduction of amorphous silicon nitride (a-Si3N4) thin films, in which the thermal transport is inherently impeded by the atomic disorders. Ultrafine nanostructuring with feature sizes below 20 nm allows us to fully suppress contribution of the propagating vibrational modes (propagons), leaving only the diffusive vibrational modes (diffusons) to contribute to thermal transport in a-Si3N4 A combination of the phonon-gas kinetics model and the Allen-Feldmann theory reproduced the measured results without any fitting parameters. The thermal conductivity reduction was explained as extremely strong diffusive boundary scattering of both propagons and diffusons. These findings give rise to substantial tunability of thermal conductivity of amorphous materials, which enables us to provide better thermal solutions in microelectronic devices.

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Tipo de estudo: Prognostic_studies Idioma: En Ano de publicação: 2020 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Tipo de estudo: Prognostic_studies Idioma: En Ano de publicação: 2020 Tipo de documento: Article