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Optical-Relayed Entanglement Distribution Using Drones as Mobile Nodes.
Liu, Hua-Ying; Tian, Xiao-Hui; Gu, Changsheng; Fan, Pengfei; Ni, Xin; Yang, Ran; Zhang, Ji-Ning; Hu, Mingzhe; Guo, Jian; Cao, Xun; Hu, Xiaopeng; Zhao, Gang; Lu, Yan-Qing; Gong, Yan-Xiao; Xie, Zhenda; Zhu, Shi-Ning.
Afiliação
  • Liu HY; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Tian XH; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Gu C; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Fan P; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Ni X; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Yang R; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Zhang JN; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Hu M; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Guo J; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Cao X; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Hu X; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Zhao G; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Lu YQ; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Gong YX; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Xie Z; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
  • Zhu SN; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
Phys Rev Lett ; 126(2): 020503, 2021 Jan 15.
Article em En | MEDLINE | ID: mdl-33512193
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article
Texto completo
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article